Constant pressure to develop new and improved electronics equipment drives innovation in semiconductor devices. Thermal management and electrical integrity are two key challenges that must be addressed in order to meet customer demand for higher performance, smaller packaging, lower power consumption, and lower cost.
- All values are calculated by simulating the test method using a wind tunnel according to the JEDEC standard. Air velocity of 0 m/s represents natural convection under still air in the wind tunnel specified in the JEDEC standard.
- Thermal characteristics are affected by environmental conditions such as the density of the copper pattern on the test board, etc.
Optical Device Products
Specifications for individual devices are shown in each data sheet.
Please search data sheet of the product from this site or contact a Renesas Electronics sales representative.
Transient Thermal Resistance
Heat is generated at channels by power loss and then conducted from channels to atmosphere via the die, the die attach material, and the heat sink.
Safe Operating Area (SOA) or Area of Safe Operating (ASO)
Please use discrete devices within a safe operating area specified in data sheet.
There are five constraints to the safe operating area
- Current Limit … Line A
- Voltage Limit … Line B
- Power Dissipation Limit … Line C
- RDS(on) Limit … Line D
- Second breakdown Limit … Line E
Second breakdown may occur in some transistors.