The ISL6327 controls microprocessor core voltage regulation by driving up to 6 synchronous-rectified buck channels in parallel. Multiphase buck converter architecture uses interleaved timing to multiply channel ripple frequency and reduce input and output ripple currents. Lower ripple results in fewer components, lower component cost, reduced power dissipation, and smaller implementation area. Microprocessor loads can generate load transients with extremely fast edge rates. The ISL6327 utilizes Intersil's proprietary Active Pulse Positioning (APP) and Adaptive Phase Alignment (APA) modulation scheme to achieve the extremely fast transient response with fewer output capacitors. today's microprocessors require a tightly regulated output voltage position versus load current (droop). The ISL6327 senses the output current continuously by utilizing patented techniques to measure the voltage across the dedicated current sense resistor or the DCR of the output inductor. Current sensing provides the needed signals for precision droop, channel-current balancing, and overcurrent protection. A programmable integrated temperature compensation function is implemented to effectively compensate the temperature variation of the current sense element. The current limit function provides the overcurrent protection for the individual phase. A unity gain, differential amplifier is provided for remote voltage sensing. Any potential difference between remote and local grounds can be completely eliminated using the remote-sense amplifier. Eliminating ground differences improves regulation and protection accuracy. The thresholdsensitive enable input is available to accurately coordinate the start-up of the ISL6327 with any other voltage rail. Dynamic-VID™ technology allows seamless on-the-fly VID changes. The offset pin allows accurate voltage offset settings that are independent of VID setting.

特長

  • Proprietary Active Pulse Positioning and Adaptive Phase Alignment Modulation Scheme
  • Precision Multiphase Core Voltage Regulation
  • Differential Remote Voltage Sensing
  • ±0.5% System Accuracy Over Life, Load, Line and Temperature
  • Adjustable Precision Reference-Voltage Offset
  • Precision Resistor or DCR Current Sensing
  • Accurate Load-Line Programming
  • Accurate Channel-Current Balancing
  • Differential Current Sense
  • Microprocessor Voltage Identification Input
  • Dynamic VID™ Technology
  • 8-Bit VID Input with Selectable VR11 code and Extended VR10 Code at 6.25mV Per Bit
  • 0.5V to 1.600V Operation Range
  • Thermal Monitoring
  • Integrated Programmable Temperature Compensation
  • Overcurrent Protection and Channel Current Limit
  • Overvoltage Protection with OVP Output Indication
  • 2, 3, 4, 5 or 6 Phase Operation
  • Adjustable Switching Frequency up to 1MHz Per Phase
  • Package Option
  • QFN Compliant to JEDEC PUB95 MO-220 QFN - Quad Flat No Leads - Product Outline
  • QFN Near Chip Scale Package Footprint; Improves PCB Efficiency, Thinner in Profile
  • Pb-Free (RoHS Compliant)

tune製品選択

製品名 Part Status Pkg. Type Carrier Type MOQ 購入/サンプル
Active QFN Tube 43
Availability
Active QFN Reel 4000
Availability
Active QFN Tube 43
Availability
Active QFN Reel 4000
Availability

descriptionドキュメント

タイトル language 分類 形式 サイズ 日付
データシート
star ISL6327 Datasheet データシート PDF 1.32 MB
ユーザーガイド、マニュアル
ISL6327EVAL5 User Guide マニュアル-開発ツール PDF 876 KB
アプリケーションノート、ホワイトペーパー
Five Easy Steps to Create a Multi-Load Power Solution ホワイトペーパー PDF 846 KB
AN1681: Grounding Techniques アプリケーションノート PDF 509 KB
AN1684: Nonideality of Ground アプリケーションノート PDF 397 KB
PCN / PDN
PCN20029A - Alternate bond wire material and assembly facility of the listed Renesas QFN packaged products 製品変更通知 PDF 327 KB
PCN15046 - Wafer Fabrication Site Change for Listed Intersil Products - Global Foundry P6 Process transfer to Palm Bay - Phase II 製品変更通知 PDF 398 KB
PCN13064 - Alternate Bond Wire Material and Manufacturing Facilities for Assembly of the Listed Intersil DFN/QFN Packaged Products - Carsem (CAS) Ipoh, Malaysia 製品変更通知 PDF 151 KB
PCN13025B - Alternate Bond Wire Material and Manufacturing Facilities for Assembly of the Listed Intersil DFN/QFN Packaged Products 製品変更通知 PDF 222 KB
PCN13025 - Alternate Bond Wire Material and Manufacturing Facilities for Assembly of the Listed Intersil DFN/QFN Packaged Products - Advanced Semiconductor Engineering (ASECL) - Chung-Li , Taiwan and STATS ChipPAC (SCM) - Kuala Lumpur, Mal 製品変更通知 PDF 106 KB
PCN13009 - Alternate Bond Wire Material and Manufacturing Facilities for Assembly of the Listed Intersil DFN/QFN Packaged Products - Advanced Semiconductor Engineering (ASECL) - Chung-Li (ASECL), Taiwan and STATS ChipPAC (SCM) - Kuala Lump 製品変更通知 PDF 173 KB
PCN10055 - Alternate Bond Wire Material for Assembly of the Listed Intersil DFN/QFN Packaged Products - STATS ChipPAC Malaysia 製品変更通知 PDF 248 KB
その他資料
ISL6327 2-Phase iSim:PE Model 回路図 SXSCH 369 KB
ISL6327 3-Phase iSim:PE Model 回路図 SXSCH 420 KB
ISL6327 4-Phase iSim:PE Model 回路図 SXSCH 471 KB
ISL6327 5-Phase iSim:PE Model 回路図 SXSCH 522 KB
ISL6327 6-Phase iSim:PE Model 回路図 SXSCH 572 KB

select_allソフトウェア/ツールページ

タイトル 分類 Description Company
iSim オンライン設計/シミュレーションツール Simulator iSim Personal Edition(iSim:PE)は、プロジェクトの早い段階で設計サイクルを加速しリスクを低減し、現在および次世代の設計で使用できる部品を特定します。 Renesas