The QS3VH2245 is a high bandwidth 8-bit bus switch. The QS3VH2245, with 25 ohm ON resistance and 1.35ns propagation delay, is ideal for line matching and low noise environments. The combination of small propagation delay, high OFF impedance, and over-voltage tolerance makes the QS3VH2245 ideal for high performance communication applications. The QS3VH2245 operates from -40C to +85C.

特長

  • N channel FET switches with no parasitic diode to VCC
  • Isolation under power-off conditions
  • No DC path to VCC or GND
  • 5V tolerant in OFF and ON state
  • 5V tolerant I/Os
  • Flat RON characteristics over operating range
  • Rail-to-rail switching 0 - 5V
  • Bidirectional dataflow with near-zero delay: no added ground bounce
  • Excellent RON matching between channels
  • VCC operation: 2.3V to 3.6V
  • High bandwidth
  • LVTTL-compatible control Inputs
  • Undershoot Clamp Diodes on all switch and control Inputs
  • Low I/O capacitance, 4pF typical
  • 25 ohm resistors for low noise and line matching
  • Available in 20 pin QSOP and TSSOP packages

製品選択

発注型名 Part Status Pkg. Type Lead Count (#) Temp. Grade Pb (Lead) Free Carrier Type 購入/サンプル
QS3VH2245PAG
Active TSSOP 20 C はい Tube
Availability
QS3VH2245PAG8
Active TSSOP 20 C はい Reel
Availability
QS3VH2245QG
Active QSOP 20 C はい Tube
Availability
QS3VH2245QG8
Active QSOP 20 C はい Reel
Availability

ドキュメント&ダウンロード

タイトル 他の言語 分類 形式 サイズ 日付
データシート
QS3VH2245 Datasheet データシート PDF 330 KB
Errata LEN-08-01 エラッタ PDF 65 KB
アプリケーションノート、ホワイトペーパー
AN-20: Board Assembly for 0.4mm Pin Surface Mounts アプリケーションノート PDF 62 KB
PCN / PDN
PCN# : A1808-01 Transfer Assembly Location from Amkor Philippines for select pacakges 製品変更通知 PDF 39 KB
PCN# : A1602-01(R1) Add Greatek Taiwan as Alternate Assembly 製品変更通知 PDF 611 KB
PCN# : A1602-01 Add Greatek Taiwan as Alternate Assembly 製品変更通知 PDF 611 KB
PCN# : A1511-01(R1) Add SPEL India as Alternate Assembly Location 製品変更通知 PDF 596 KB
PCN# : A1511-01 Add SPEL India as Alternate Assembly Location 製品変更通知 PDF 544 KB
PCN# : TB1503-01R1 Carrier Tape Standardization for Selective Packages 製品変更通知 PDF 333 KB
PCN# : TB1503-01 Carrier Tape Standardization for Selective Packages 製品変更通知 PDF 291 KB
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w 製品変更通知 PDF 24 KB
PCN# A-0508-02: OSET Alternate Assembly Location for Green 製品変更通知 PDF 18 KB
PCN# A-0504-02R2: Assembly Transfer IDT-Manila to OSE-Ph 製品変更通知 PDF 38 KB
PCN#A-0504-02R1: Assembly Transfer IDT-Manila to OSE-Ph 製品変更通知 PDF 16 KB
PCN#: A-0504-02, Transfer assembly facility IDT-Manila to OSE-Ph 製品変更通知 PDF 47 KB
PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT 製品変更通知 PDF 35 KB
PCN#:A-0312-01, new mold compound material - G600 製品変更通知 PDF 109 KB
PCN#:A-0312-02, new die attach material - 8290 製品変更通知 PDF 116 KB
PCN Addendum # L0203-10R1 Fab 2 to Fab 4 Transfer 製品変更通知 PDF 110 KB
PCN# L0206-11 ICCQ Max Limit Change 製品変更通知 PDF 9 KB
PCN# G-0203-05 Mold Compound 製品変更通知 PDF 40 KB
PCN# L0203-10 Fab Transfer from Fab 2 to Fab 4 製品変更通知 PDF 27 KB
PCN# G0202-01, Alternate assembly facility 製品変更通知 PDF 16 KB
PCN# L0108-01R1, Die Revision from YQ, ZQ, QC to Z 製品変更通知 PDF 12 KB
PCN# G0106-01, Moisture Sensitive Label Change 製品変更通知 PDF 274 KB
PCN# G0005-01, Laser Top Mark 製品変更通知 PDF 24 KB
ダウンロード
QS3VH2245 IBIS Model モデル-IBIS ZIP 9 KB
QS3VH2245 Hspice Model モデル-HSPICE ZIP 18 KB