The Renesas RA4W1 is the first Bluetooth® 5.0 Low Energy fully compliant with 2Mbit High-Throughput (HT) and Long Range support in a single chip MCU of Renesas RA4 product series for IoT applications that require a high-performance Arm® Cortex®-M4 core at a very attractive price point. The RA4W1 is built on a highly efficient low power process and is supported by an open and flexible ecosystem concept, called Flexible Software Package (FSP), using FreeRTOS as base. RA4W1 is geared towards IoT application requiring Security, large embedded RAM and low power consumption.

Features

  • 48MHz Arm® Cortex®-M4
  • 512kB Flash Memory and 96kB SRAM
  • 8kB Data Flash to store data as in EEPROM
  • 7x7 mm QFN 56-pin package
  • Capacitive touch sensing unit
  • Segment LCD controller
  • USB 2.0 Full Speed module supporting host and device mode
  • CAN 2.0B
  • SCI (UART, Simple SPI, Simple I2C)
  • SPI/ I2C multimaster interface
  • 2.4 GHz radio with Bluetooth 5.0 Low Energy
  • LE 1M, 2M, Coded PHY, and LE advertising extension
  • Secure Crypto Engine (AES128 / 256, GHASH, TRNG)

Applications

  • Security (fire detection, burglar detection, panel control)
  • Metering (electricity, automated meter reading)
  • Industry (robotics, door openers, sewing machines, vending machines, UPS)
  • Health and wearables body sensors
  • Smart home and remote control toys

Product Options

Orderable Part ID Part Status Type Carrier Type Buy Sample
Active
Availability

Documentation & Downloads

Title Other Languages Type Format File Size Date
Datasheets & Errata
Renesas RA4W1 Group Datasheet Datasheet PDF 1.52 MB
User Guides & Manuals
List of MCUs supported by PG-FP6 日本語 Manual PDF 216 KB
List of MCUs supported by Renesas Flash Programmer V3 日本語 Manual PDF 168 KB
Renesas RA4W1 Group User's Manual: Hardware 日本語 Manual PDF 16.39 MB
Renesas Flexible Software Package (FSP) v1.0.0 User's Manual Manual PDF 16.30 MB
Application Notes & White Papers
EK-RA4W1 Example Project Bundle Application Note PDF 72 KB
- EK-RA4W1 Example Project Bundle Application Note PDF 72 KB
PG-FP6 Usage of Communications Commands 日本語 Application Note PDF 369 KB
RA Family BLE Sample Application Application Note PDF 2.57 MB
- RA Family BLE Sample Application Application Note PDF 2.57 MB
- Host Controller Interface Firmware Application Note PDF 351 KB
- Tuning procedure of Bluetooth dedicated clock frequency Application Note PDF 1.07 MB
- Public BD Address writing tool Application Note PDF 140 KB
Bluetooth® Low Energy microcomputer Design Guidelines for a Pattern Antenna Application Note 日本語 Application Note PDF 2.92 MB
Public BD Address writing tool Application Note PDF 140 KB
RA4W1 Group Guidelines for 2.4 GHz Wireless Board Design Application Note PDF 680 KB
Tuning procedure of Bluetooth dedicated clock frequency Application Note PDF 1.07 MB
Host Controller Interface Firmware Application Note PDF 351 KB
- RX23W Bluetooth Test Tool Suite operating instructions Application Note 日本語 Application Note PDF 3.24 MB
RA Family Using QE and FSP to Develop Capacitive Touch Application 日本語 Application Note PDF 963 KB
Renesas RA Family Flash Memory Programming Application Note PDF 1.85 MB
Renesas RA Family System Specifications for Standard Boot Firmware Application Note PDF 749 KB
PCB-Design for Improved EMC / EMV Application Note PDF 1.86 MB
PCNs & PDNs
Unification of a JEDEC tray and a embossed carrier tape for LQFP package (Additional Information & Correction) 日本語 Product Change Notice PDF 4.86 MB
Unification of a JEDEC tray and a embossed carrier tape for LQFP package 日本語 Product Change Notice PDF 3.74 MB
Unification of a JEDEC tray and a embossed carrier tape for LQFP package 日本語 Product Change Notice PDF 1.46 MB
Downloads
- EK-RA4W1 Example Project Bundle Sample Code ZIP 2.93 MB
EK-RA4W1 Example Project Bundle Sample Code ZIP 2.93 MB
QE for BLE[RA] V1.1.0 : A Dedicated Tool for Bluetooth® low energy. 日本語 Upgrade - IDE ZIP 9.96 MB
- RA Family BLE Sample Application Sample Code ZIP 3.38 MB
RA Family BLE Sample Application Sample Code ZIP 3.38 MB
RA Family QE for BLE [RA]: Sample Projects and Dedicated Programs for the R_BLE Scripts 日本語 Sample Code ZIP 2.05 MB
EK-RA4W1v0 - Design Package 日本語 Software ZIP 1.34 MB
Host Controller Interface Firmware Sample Code ZIP 9.90 MB
Tuning procedure of Bluetooth dedicated clock frequency Sample Code ZIP 5.10 MB
Public BD Address writing tool Sample Code ZIP 137 KB
- Public BD Address writing tool Sample Code ZIP 137 KB
- Tuning procedure of Bluetooth dedicated clock frequency Sample Code ZIP 5.10 MB
- Host Controller Interface Firmware Sample Code ZIP 9.90 MB
QE for BLE[RA] V1.0.0 : A Dedicated Tool for Bluetooth® low energy. 日本語 Software ZIP 9.73 MB
Bluetooth Test Tool Suite operating instructions Application Note Sample Code ZIP 21.67 MB
Tool News
[Notification] Flash Programmer Survey Invitation 日本語 Tool News - Notification PDF 29 KB
[Upgrade to revision] Solution Toolkit QE for BLE[RA] V1.1.0: Development Assistance Tool for Bluetooth® Low Energy 日本語 Tool News - Release PDF 105 KB
[Upgrade to revision] Programming GUI for PG-FP6 Flash Memory Programmer (FP6 Terminal) V1.05.00 日本語 Tool News - Release PDF 72 KB
[Upgrade to revision] Programming GUI for PG-FP6 Flash Memory Programmer (FP6 Terminal) V1.04.02 日本語 Tool News - Release PDF 74 KB
[Notification] Renesas Flash Programmer V3.06.01 Addition of Supported Devices and End of Device Support 日本語 Tool News - Notification PDF 28 KB
[Upgrade to revision] Programming GUI for PG-FP6 Flash Memory Programmer (FP6 Terminal) V1.04.01 日本語 Tool News - Release PDF 73 KB
[Released on the Web] Solution Toolkit QE for BLE[RA] V1.0.0: Development Assistance Tool for Bluetooth® Low Energy 日本語 Tool News - Release PDF 487 KB
Other
e² studio 2020-10 Release Note Release Note PDF 2.46 MB
PG-FP6 Flash Memory Programmer Release Note 日本語 Release Note PDF 269 KB
Errata for User's Manual: Hardware for HOCO 日本語 Technical Update PDF 113 KB
QE for BLE [RA] V1.1.0 Release Note 日本語 Release Note PDF 141 KB
RA4W1 Group Bluetooth LE Profile API Document User's Manual Others ZIP 6.08 MB
e² studio 2020-07 Release Note Release Note PDF 1.52 MB
RA4W1 Group Flyer 日本語 Flyer PDF 381 KB
QE for BLE[RA] V1.0.0 Release Note 日本語 Release Note PDF 131 KB
e² studio V7.8.0 Release Note Release Note PDF 1.26 MB
e² studio 2020-04 Release Note Release Note PDF 1.30 MB
[Flyer] E2Emulator[RTE0T00020KCE00000R] 日本語, 简体中文 Flyer PDF 381 KB
- Renesas Flexible Software Package (FSP) v1.0.0 User's Manual Software & Tools - Others ZIP 12.55 MB
RA Family Flyer 日本語 Flyer PDF 391 KB
Building Automation Brochure 日本語 Brochure PDF 6.65 MB

Software / Tools

Title Type Description Company
Flexible Software Package (FSP) Software Package The Renesas RA Flexible Software Package (FSP) provides a quick and versatile way to build secure connected Internet of Things (IoT) devices using the Renesas RA Family of Arm microcontrollers (MCUs). FSP provides production ready peripheral drivers, FreeRTOS and middleware stacks to take advantage of the FSP ecosystem. Renesas
E2 emulator [RTE0T00020KCE00000R] Emulator On-chip debugging emulator. Also available as a flash memory programmer. [Support MCU/MPU: RA, RE, RH850, R-Car D1, RL78, RX] Renesas
E2 emulator Lite [RTE0T0002LKCE00000R] Emulator On-chip debugging emulator. Also available as a flash memory programmer. [Support MCU/MPU: RA, RE, RL78, RX] Renesas
e² studio IDE and Coding Tool Eclipse-based Renesas integrated development environment (IDE). (Note: You need to install compiler separately as an additional software) Renesas
PG-FP6 Programmer (Unit/SW) Flash memory programmer [Programming software: Dedicated GUI-based software, the "FP6 Terminal"] [Support MCU/MPU and devices: RA, RE, RX, RL78, RH850, Renesas Synergy, Power Management, Renesas USB Power Delivery Family, ICs for Motor Driver/Actuator Driver, SuperH RISC engine, V850, 78K, R8C] Renesas
Renesas Flash Programmer (Programming GUI) Programmer (Unit/SW) Flash memory programming software [Support MCU/MPU and devices: RA, RE, RX, RL78, RH850, Renesas Synergy, Power Management, Renesas USB Power Delivery Family, ICs for Motor Driver/Actuator Driver, V850, 78KR, 78K0] Renesas
QE for Capacitive Touch: Development Assistance Tool for Capacitive Touch Sensors Solution Toolkit In developing embedded system using the capacitive touch sensor of RA family and RX family MCUs, you can easily setup initial configurations of the touch interface as well as process the tuning of sensors, and reduce development time. [Plugin for Renesas IDE "e2 studio"]
Renesas
QE for BLE: Development Assistance Tool for Bluetooth® Low Energy Solution Toolkit Debugging support tool that specializes in Bluetooth® low energy system development [Plugin for Renesas IDE "e2 studio"] [Support MCU/MPU: RA, RX, RL78] Renesas

Boards & Kits

Part Number Title Type Company
EK-RA4W1 RA4W1 MCU Group Evaluation Board Evaluation

Pin Count / Memory Size

Flash: 512kB
RAM: 96kB
Pin Count
Package
Size
Pitch
56-pin
QFN
7x7mm
0.5mm