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ルネサス エレクトロニクス株式会社 (Renesas Electronics Corporation)
VME to PCI-X Bridge

パッケージ情報

CADモデル:View CAD Model
Pkg. Type:PBGA
Pkg. Code:BB456
Lead Count (#):456
Pkg. Dimensions (mm):27.0 x 27.0 x 2.65
Pitch (mm):1

環境及び輸出分類情報

Pb (Lead) FreeNo
Moisture Sensitivity Level (MSL)3
ECCN (US)
HTS (US)

製品スペック

Pkg. TypePBGA
Lead Count (#)456
Pb (Lead) FreeNo
Carrier TypeTray
Length (mm)27
MOQ20
Moisture Sensitivity Level (MSL)3
PCI Bus133MHz/64-bit PCI-X, 66MHz/64-bit PCI
Package Area (mm²)729
Pb Free Categorye0
Pitch (mm)1
Pkg. Dimensions (mm)27.0 x 27.0 x 2.65
Power Consumption Max (W)1.8
Qty. per Carrier (#)40
Qty. per Reel (#)0
Requires Terms and ConditionsDoes not require acceptance of Terms and Conditions
Tape & ReelNo
Temp. Range (°C)0 to 70°C
Thickness (mm)2.65
VME BusVME64, 2eVME, 2eSST
Width (mm)27

説明

The TSI148 is the latest-generation component in IDT’s industry-leading, high-performance VMEbus system interconnect product family. The device is fully compliant with the 2eSST and VME64 Extension standards which allow designers to take advantage of the higher performance VME protocols, while preserving existing investment in VME boards that implement legacy protocols. TheTSI148 increases a system’s usable bus bandwidth through a local bus interface designed for the PCI/X processors and peripherals that support either a 66 MHz PCI bus or a 133 MHz PCI-X bus interface.