AI生成コンテンツ: Two reference designs for an IO-Link sensing solution combine the ZSSC3286 dual-channel resistive sensor signal conditioner and the RH4Z2501 single-channel IO-Link physical layer transceiver. The designs focus on circuit schematics and PCB layouts optimized for EMC performance and thermal management. Both designs pass IO-Link conformance tests including functional and environmental tests such as ESD, EMC, burst, surge, and radiated emissions. Key design guidelines include short communication tracks, separation of high and low voltage areas, solid ground and power planes, via stitching, and proper capacitor placement. The document details two package types: QFN/DFN and WLCSP, with PCB stack-ups and layer layouts provided. PCB design files include BOM, schematics, and Gerber files.