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ルネサス エレクトロニクス株式会社 (Renesas Electronics Corporation)

パッケージ情報

CADモデル:View CAD Model
Pkg. Type:CFP
Pkg. Code:KBP
Lead Count (#):14
Pkg. Dimensions (mm):9.8 x 6.5 x 0.00
Pitch (mm):1.3

環境及び輸出分類情報

Moisture Sensitivity Level (MSL)Not Applicable
Pb (Lead) FreeExempt
ECCN (US)
HTS (US)

製品スペック

Pkg. TypeCFP
Lead Count (#)14
Carrier TypeTray
Moisture Sensitivity Level (MSL)Not Applicable
Pitch (mm)1.3
Pkg. Dimensions (mm)9.8 x 6.5 x 0.00
DLA SMD5962R9582602VXC
Pb (Lead) FreeExempt
Pb Free CategoryGold Plate over compliant Undercoat-e4
MOQ25
Temp. Range (°C)-55 to +125°C
DSEE (MeV·cm2/mg)75
Length (mm)9.8
Qualification LevelQML Class V (space)
RatingSpace
TID HDR (krad(Si))100
TID LDR (krad(Si))ELDRS free
Width (mm)6.5

説明

The CD4000BMS (dual 3 plus inverter), CD4001BMS (quad 2-input), CD4002BMS (dual 4-input), and CD4025BMS (triple 3-input) NOR gates provide the system designer with direct implementation of the NOR function and supplement the existing family of CMOS gates. All inputs and outputs are buffered. The CD4000BMS, CD4001BMS, CD4002BMS, and the CD4025BMS are supplied in these 14-lead outline packages: Braze Seal DIP H4X and H4Q, Frit Seal DIP H1B, and Ceramic Flatpack H3W.