パッケージ情報
| CADモデル: | View CAD Model |
| Pkg. Type: | DIE |
| Pkg. Code: | |
| Lead Count (#): | |
| Pkg. Dimensions (mm): | 0.0 x 0.0 x 0.00 |
| Pitch (mm): |
環境及び輸出分類情報
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Pb (Lead) Free | Yes |
| RoHS (CD4001BHSR) | 英語日本語 |
| ECCN (US) | |
| HTS (US) |
製品スペック
| Pkg. Type | DIE |
| Carrier Type | Die Waffle Pack |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Pkg. Dimensions (mm) | 0.0 x 0.0 x 0.00 |
| DLA SMD | 5962R9582602V9A |
| Pb (Lead) Free | Yes |
| Pb Free Category | None |
| MOQ | 100 |
| Temp. Range (°C) | -55 to +125°C |
| DSEE (MeV·cm2/mg) | 75 |
| Lead Compliant | No |
| Qualification Level | QML Class V (space) |
| Rating | Space |
| TID HDR (krad(Si)) | 100 |
| TID LDR (krad(Si)) | ELDRS free |
| Tape & Reel | No |
CD4001BMS に関するリソース
説明
The CD4000BMS (dual 3 plus inverter), CD4001BMS (quad 2-input), CD4002BMS (dual 4-input), and CD4025BMS (triple 3-input) NOR gates provide the system designer with direct implementation of the NOR function and supplement the existing family of CMOS gates. All inputs and outputs are buffered. The CD4000BMS, CD4001BMS, CD4002BMS, and the CD4025BMS are supplied in these 14-lead outline packages: Braze Seal DIP H4X and H4Q, Frit Seal DIP H1B, and Ceramic Flatpack H3W.