パッケージ情報
| CADモデル: | View CAD Model |
| Pkg. Type: | TSSOP |
| Pkg. Code: | |
| Lead Count (#): | |
| Pkg. Dimensions (mm): | 2.9 x 4.31 |
| Pitch (mm): | 0.65 |
環境及び輸出分類情報
| Moisture Sensitivity Level (MSL) | 1 |
| Pb (Lead) Free | Yes |
| ECCN (US) | |
| HTS (US) |
製品スペック
| Pkg. Type | TSSOP |
| Carrier Type | Tape & Reel |
| Moisture Sensitivity Level (MSL) | 1 |
| Country of Assembly | PHILIPPINES |
| Country of Wafer Fabrication | TAIWAN |
| Deep Power Down (µA) | 0.35 |
| Flash by Task | Boot Loader |
| Interface | Single, Dual SPI |
| Key Benefit | Fast read, 2.3 Volt |
| MOQ | 8000 |
| Memory Class | FusionHD |
| Memory Density | 0.512 |
| Operating Voltage Range (V) | 2.3 - 3.6 |
| Pb (Lead) Free | Yes |
| Pitch (mm) | 0.65 |
| Pkg. Dimensions (mm) | 2.9 x 4.31 |
| Price (USD) | $0.43491 |
| Qty. per Reel (#) | 4000 |
| Read Current (mA) | 6 |
| Speed | 104 MHz |
| Supply Voltage Vcc (V) | 2.3 - 2.3 |
| Temp. Range (°C) | -40 to +85°C |
| Vcc (V) | 2.3-3.6 |
AT25DN512C に関するリソース
説明
The AT25DN512C is a serial interface Flash memory device designed for use in a wide variety of high-volume consumer-based applications in which program code is shadowed from Flash memory into embedded or external RAM for execution. The flexible erase architecture of the AT25DN512C, with its page erase granularity, is ideal for data storage as well, eliminating the need for additional data storage devices.
