ルネサス エレクトロニクス株式会社 (Renesas Electronics Corporation) - 6月はプライド月間として、LGBTQ+の権利や文化、コミュニティについて啓発する世界的な活動月間です
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デジアナ混載ASIC

ASIC Solutions Designed for Your Unique Needs

Renesas experts provide dedicated support throughout your development process, leveraging advanced technical expertise gained over decades in the semiconductor industry. We can turn your vision into innovative products with exceptional digital and mixed-signal ASIC solutions. Our custom development process incorporates a wide range of products, including digital SoCs, sensors, and actuators. Combining high-performance computing expertise, a wide range of CPU subsystem cores, and integrated IP solutions, Renesas can address your unique needs and help you get to market.

Collaborative Process

Renesas ASIC teams guide you through development and help you understand the requirements from concept to production.

Extensive Application Experience

With decades of experience in digital, analog, and power domains, we deliver custom ASIC solutions for industrial, infrastructure, IoT, and automotive applications. 

Comprehensive Quality Control

We leverage secure ASIC production and quality control systems optimized over decades of delivering unique ASIC solutions.

Design Flexibility

Dedicated experts support your project throughout the development process to identify, design, and build ASIC solutions that fit your exact specifications.

ASIC Development Process

Our expert teams guide you through development and help you understand the requirements for each step of the process. 

illustrative diagram showing renesas' comprehensive support throughout a user's product developmentjourney
  • Concept and Requirement: We collaborate with you to define the ideal architecture for the purpose, functions, and target applications of your ASIC, helping differentiate your product in the market.
  • Specification Design: Using multifaceted design solutions, including OSAT and internal and external IP, we define performance requirements, power consumption needs, functional blocks, and interconnections for your ASIC.
  • Front-End Design: Our comprehensive process includes RTL design from IP to full chip level, CPU subsystem development, and IEC 61508/ISO 26262 functional safety expertise to produce high-performance, safety-compliant designs.
  • Verification Environment: Robust simulation in our verification environment ensures precise functionality and alignment with your specifications and requirements, including virtual models and FPGA validation.
  • Back-End Design: With vast experience developing SoCs and back-end design methods, from SDC generation and STA implementation to SCAN test design and insertion, we can improve PPA even for complex, large-scale circuits.
  • Mass Production and Supply: We leverage third-party flexibility and years of quality management expertise in our in-house fabs—providing support from mask creation to production, including Fab/OSAT management and delivery.

High-Performance Computing (HPC) ASICs

HPC ASICs are custom ICs designed with cutting-edge processes to support increasingly complex processing challenges. As circuit design complexity increases, power consumption and area efficiency challenges arise. Seamless development capabilities and the latest IP are essential for successful product commercialization.

Benefits of HPC ASICs

  • Seamless integration of state-of-the-art IP
  • Quick commercialization for a competitive edge
  • Wide range of supported processes through in-house fabs and foundry partners

CPU Subsystems

  • Arm Cores: We offer a wide range of Arm cores tailored to meet your required processing capabilities.
  • RISC-V Cores: Designed to be compact and efficient, our own RISC-V CPU core minimizes area usage while reducing operating current and standby leakage current.
  • Renesas Cores: Our comprehensive portfolio of MCU and MPU products delivers the highest performance and excellent expandability, helping you maximize resources.

High-Speed SerDes and DDR

Our experience integrating third-party IP allows you to choose from a wide range of options, including the latest high-speed SerDes.

CategoryProcess Node
28/22nm16/14/12nm7nm3nm
LPDDR5/DDR5  checkcheck
LPDDR4/DDR4 & DDR3checkcheckcheck 
224G/112G Ethernet  checkcheck
PCIe 6 & PCIe 5  checkcheck
PCIe 4 & Belowcheckcheckcheckcheck
USBcheckcheckcheckcheck

Mixed-Signal ASICs

Mixed-signal ASICs are custom ICs that combine analog and digital processing to support a wide variety of advanced electronics products. Renesas is the leading supplier of custom mixed-signal ASIC solutions. We deliver precisely engineered solutions that provide best-in-class performance—optimized for space, cost, and scheduling constraints.

Benefits of Mixed-Signal ASICs

  • Perfectly Matched Technology: Optimized for processes from 350nm to 40nm, including high-voltage and BCD options
  • Small Size: Reduced die size by up to 75% through integration
  • Industry Standards: Designed to meet rigorous requirements like IATF16949 for automotive applications
  • Large IP Library: Access a wealth of silicon-proven IP for robust performance

Our ASIC Offerings

Whether you're creating cutting-edge systems or looking to optimize existing designs, our diverse range of ASIC offerings ensures we have the perfect solution to help you succeed.

  • Full Custom SoCs: Highly flexible and high-performance SoCs from scratch
  • Semi-Custom SoCs: Reduced cost and development time from existing SoC circuits
  • Embedded eFPGA: Embedded eFPGA to provide scalability to meet future needs
  • ASIC SiP: ASIC circuit chips combined with other chips, such as PMIC or analog circuits
  • Chiplet: Chips with optimal processes for each functional block connected by an interposer
  • Other Custom SoCs: Your UDL and additional applications with embedded Renesas MPU/MCU circuits

ASIC Package

Our wide range of package options—from SOP/QFP/QFN to WL-CSP and FCBGA—covers small to large pin counts and sizes. We also provide 2D MCM solutions for SiP (system-in-package) applications, such as SOC+DRAM/flash and SOC+SOC. We continuously advance technical development in collaboration with in-house fab and OSAT partners to develop new packages to meet current and future market needs. 

 PastPresentFuture
High Speed/Low PowerQFP/QFNFC BGA  2.5D Si-IP (Chiplet)Optoelectrical
SOPWB BGA2D MCM (Chiplet) 2.5 RDL-IP (Chiplet)3D
High Density WL-CSPFO-WLP3D TSV  

Extensive Process Solutions

Our wide range of processes leverage in-house fabs and foundry partners for greater flexibility.

Standard Processes

40nm

28nm

16nm

14nm

12nm

10nm

7nm

5nm

3nm

2nm

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Feasibility Study

High Voltage Processes

350nm

180nm

130nm

55nm

40nm

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Contact Us

For general inquiries about ASICs, please contact us

ルネサスの高性能ASICは、より小さなフォーム・ファクタで電力と性能を最適化するカスタマイズされたICです。 差別化とクラス最高の性能を提供する、精密に設計されたソリューションをお届けします。

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