メインコンテンツに移動
64K x 20/128K x 10 TeraSync DDR FIFO, 2.5V

パッケージ情報

Pkg. Type: WAFER
Pkg. Code: DICE
Lead Count (#):
Pkg. Dimensions (mm): 0.0 x 0.0 x 0.0
Pitch (mm):

環境及び輸出分類情報

Pb (Lead) Free Yes
Moisture Sensitivity Level (MSL) 1
ECCN (US)
HTS (US)

製品スペック

Pkg. Type WAFER
Lead Count (#) 0
Pb (Lead) Free Yes
Carrier Type Wafer
MOQ 1
Moisture Sensitivity Level (MSL) 1
Pb Free Category e3 Sn
Pkg. Dimensions (mm) 0.0 x 0.0 x 0.0
Qty. per Carrier (#) 0
Qty. per Reel (#) 0
Requires Terms and Conditions Does not require acceptance of Terms and Conditions
Tape & Reel No
Temp. Range (°C) 0 to 70°C
掲載 No

説明

This product is obsolete.