WPO (WLCSP-BP 25)

タイトル	情報
Pkg. Name Name used to describe Renesas packages.	W5X5.25H
Pkg. Previous Code Package code maintained as part of the Renesas and Intersil merger.	WPO
Package Description Descriptive text for this package.	25 Ball 5x5 Array UltraThin Wafer Level Chip Scale Package (WLCSP 0.4mm Pitch)
Package Status	Active
Package Type	WLCSP-BP
クラス	PLASTIC
Package Code The unique identifier of this package.	WPO
カテゴリ	PLASTIC
Lead Count	25
Pb (Lead) Free	Yes
長さ	2.07mm
幅	2.07mm
Thickness 取り付け高さ or 本体高さ (外形図をご参照ください)	0.28mm
Pitch	0.4mm
Pkg. Dimensions (mm) Package Dimensions. Example: 5 x 7 x 0.5	2.07 x 2.07 x 0.28