pkg_2531 (HBGA 2209)

タイトル	情報
Pkg. Name Name used to describe Renesas packages.	PRBG2209FA-A
Pkg. Previous Code Package code maintained as part of the Renesas and Intersil merger.	P2209F5-100-ZA2-1
JEITA Standard The JEITA standard to which the device is compliant.	P-HBGA2209-50x50-1.00
Package Status	Active
Package Type	HBGA
クラス	IC
Package Code The unique identifier of this package.	pkg_2531
Lead Count	2209
Pb (Lead) Free	Yes
長さ	50mm
幅	50mm
Thickness 取り付け高さ or 本体高さ (外形図をご参照ください)	3.85mm
Pkg. Dimensions (mm) Package Dimensions. Example: 5 x 7 x 0.5	50 x 50 x 3.85