| タイトル | 情報 | 
|---|---|
| Pkg. Name Name used to describe Renesas packages. | M20.3 | 
| Pkg. Previous Code Package code maintained as part of the Renesas and Intersil merger. | MEP | 
| Package Description Descriptive text for this package. | 20 LEAD SOIC (300MIL) | 
| Package Status | Active | 
| Package Type | SOICW | 
| クラス | PLASTIC | 
| Package Code The unique identifier of this package. | MEP | 
| カテゴリ | PLASTIC | 
| Lead Count | 20 | 
| Pb (Lead) Free | Yes | 
| 長さ | 12.85mm | 
| 幅 | 7.52mm | 
| Thickness 取り付け高さ or 本体高さ (外形図をご参照ください) | 0mm | 
| Pitch | 1.27mm | 
| Pkg. Dimensions (mm) Package Dimensions.  Example: 5 x 7 x 0.5 | 12.85 x 7.52 x 0.00 |