Overview
Our market-leading portfolio of first-in, first-out (FIFO) memory solutions includes synchronous and asynchronous options. Renesas FIFO products address complex inter-chip communication challenges, such as rate matching, buffering, and bus matching. With flexible solutions for parallel FIFO structures—enabling custom word sizes and simple serial FIFO links for streamlined integration—we offer versatile tools designed for high-performance applications.
Superior Off-the-Shelf Solutions
Ideal for high-performance applications like networking, graphics, medical imaging, data acquisition, and industrial automation
Trusted Military-Grade FIFO Options
QML-certified solutions with hermetic package options, including ceramic dual inline, Cerpak, flatpack, and more
Reliable Communication Protocol Support
Standard products engineered to solve inter-chip communication issues like rate matching, buffering, and bus matching