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Overview

Description

download Download Latest Multi-OS Package:

RZ/T Multi-OS Package v1.0.2 (ZIP)

RZ/N Multi-OS Package v1.0.2 (ZIP)

RZ/T Multi-OS Package Package and RZ/N Multi-OS Package are software packages for developing multi-OS solutions, consisting of the RZ/T Flexible Software Package and RZ/N Flexible Software Package (FSP) as a software package for Renesas MCUs with Arm® Cortex-A or Cortex-R core, and OpenAMP as a standardized API for framework for interprocessor communication.
Please refer to the following documents to learn how to use this software package.

For Flexible Software Package (FSP), please refer to the following.

FSP Platform Installer (Includes e² studio IDE, toolchain, and FSP packs):

FSP Standalone Installer (FSP packs for users who only update the FSP and do not update e² studio):

  • Download from the Assets section of GitHub

The installation instructions can be found here. All the FSP releases and patches can be found on GitHub (rzt-fsp, rzn-fsp).

Image
RZ/T and RZ/N Multi-OS Package

 

Features

  • Small memory footprint HAL driver.
  • Configurator / code generator that can be operated intuitively.
  • Communication between CA55 and CR52 by OpenAMP.

Release Information

  • May 30, 2025: RZ/N Multi-OS Package v1.0.2
  • Apr 25, 2025: RZ/T Multi-OS Package v1.02
  • Dec 27, 2024: RZ/N Multi-OS Package v1.0.1, RZ/T Multi-OS Package v1.0.1
  • Nov 26, 2024: RZ/T Multi-OS Package v1.0.0

Target Devices

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Documentation

Design & Development

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Operating Environment

Integrated development environmente2 studio Integrated Development Environment, default toolchain is GCC Arm Embedded
Supported boardsRZ/T2H Evaluation Board Kit, RZ/N2H Evaluation Board Kit
EmulatorSEGGER (J-Link Series)

Supported Devices

Multi-OS PackageLinux Board Support PackageFlexible Software PackageSupported Device
RZ/T Multi-OS Package v1.0.2v1.0.2 [5.10-CIP]RZ/T2 FSP v2.2.0RZ/T2H
RZ/N Multi-OS Package v1.0.2v1.0.2 [5.10-CIP]RZ/N2 FSP v2.1.0RZ/N2H