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Intelligent Power Device

Package Information

CAD Model:View CAD Model
Pkg. Type:HSSOP
Pkg. Code:pkg_7584
Lead Count (#):12
Pkg. Dimensions (mm):8 x 6 x 2.55
Pitch (mm):1

Environmental & Export Classifications

Moisture Sensitivity Level (MSL)1
Pb (Lead) FreeYes
ECCN (US)
HTS (US)

Product Attributes

Lead Count (#)12
Moisture Sensitivity Level (MSL)1
Pb (Lead) FreeYes
Country of AssemblyJAPAN
Country of Wafer FabricationJAPAN
Automotive Qual.Yes
Channels per device (#)2
DiagnosticCurrent Sense
FunctionRobust & Safety
IL (SC) (A)13
IL (mA)1800
Lead CompliantNo
Length (mm)8
MOQ1500
Mounting TypeSMD
Nch/PchNch
Parametric CategoryProtected & Intelligent Power Devices
Pkg. Dimensions (mm)8 x 6 x 2.55
Pkg. TypeHSSOP
Price (USD)$3.02512
RON (mohm) max. @ Tj = 150 °C (mohm)180
RON (mohm) typ. @ Tj = 25 °C (mohm)70
Remarks12pHSSOP
Tape & ReelNo
Tch (Max) (°C)150
Tch (Min) (°C)-40
Thickness (mm)2.55
Type of SwitchHigh side
Vload dump (V) (V)42
Width (mm)6

Description

µPD166029T1J is part of 2nd Generation Intelligent Power Devices (IPD). They are N-channel high-side switches with charge pump, voltage controlled input, diagnostic feedback with proportional load current sense and embedded protection function. Family includes up to 10 devices depending on on-state resistance, package and channel number combination. Scalability: Variety of on-state resistance combined with standardized package on pin-out give user high flexibility for unit design depending on target load. Robustness: Because of advanced protection method, 2nd Generation Intelligent Power Devices achieve high robustness against long term and repetitive short circuit condition.