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Host Bridge

Package Information

Lead Count (#) 1023
Pkg. Code RM1023
Pitch (mm) 1
Pkg. Type FCBGA
Pkg. Dimensions (mm) 33.0 x 33.0 x 2.0

Environmental & Export Classifications

Pb (Lead) Free No
ECCN (US) NLR
HTS (US) 8542390001
Moisture Sensitivity Level (MSL) 4

Product Attributes

Lead Count (#) 1023
Pb (Lead) Free No
Carrier Type Tray
Price (USD) | 1ku 142.40333
DRAM I/F DDR2-333 MHz
Length (mm) 33.0
MOQ 48
Moisture Sensitivity Level (MSL) 4
PCI Bus 133MHz/64-bit PCI-X
Package Area (mm²) 1089.0
Pb Free Category e1 SnAgCu
Pitch (mm) 1.0
Pkg. Dimensions (mm) 33.0 x 33.0 x 2.0
Pkg. Type FCBGA
Power Consumption Max (W) 2.27
Processor Bus PowerPC 7xx/7448 -167MHz
Qty. per Carrier (#) 24
Qty. per Reel (#) 0
Requires Terms and Conditions Does not require acceptance of Terms and Conditions
Tape & Reel No
Temp. Range 0 to 70°C
Thickness (mm) 2.0
Width (mm) 33.0

Description

The TSI110 is a low-cost PowerPC interconnect device that bridges PCI/X, DDR2 SDRAM, Gigabit Ethernet, and Flash. The integrated features of the TSI110 serve to reduce the number of components in a system, resulting in significantly lower system cost, power, and design complexity. It is well suited for a variety of applications, including entry-level router and storage, consumer appliance, set-top box, video surveillance, video/IP, and printers.