Package Information
| CAD Model: | View CAD Model |
| Pkg. Type: | BGA |
| Pkg. Code: | pkg_8401 |
| Lead Count (#): | 196 |
| Pkg. Dimensions (mm): | 15 x 15 x 1.81 |
| Pitch (mm): | 1 |
Environmental & Export Classifications
| Moisture Sensitivity Level (MSL) | 3 |
| Pb (Lead) Free | Yes |
| ECCN (US) | |
| HTS (US) |
Product Attributes
| Pkg. Type | BGA |
| Lead Count (#) | 196 |
| Moisture Sensitivity Level (MSL) | 3 |
| Pb (Lead) Free | Yes |
| Temp. Range (°C) | -40 to +85 |
| Country of Assembly | JAPAN |
| Country of Wafer Fabrication | JAPAN |
| Ethernet Remarks | ２ch |
| Family Name | TPS-1 |
| I/O Ports | 48 |
| Lead Compliant | Yes |
| Length (mm) | 15 |
| MOQ | 595 |
| On-chip Oscillator | No |
| Operating Freq (Max) (MHz) | 100 |
| Operating Voltage Range (V) | 0.9 - 1.1 |
| PLL | Yes |
| Pkg. Dimensions (mm) | 15 x 15 x 1.81 |
| Price (USD) | $31.28444 |
| Remarks | Industrial communication, include PROFINET Device IP and 2port PHY, Power Supply = VDD = 0.9 to 1.1 V, VDDIO = 3.0 to 3.6V |
| SPI (ch) | 1 |
| Tape & Reel | No |
| Thickness (mm) | 1.81 |
| Timer | Watchdog Timer x 1-ch |
| UART (ch) (#) | 1 |
| Width (mm) | 15 |
Resources for TPS-1
Description
The PROFINET IO Device Chip TPS-1 reduces the time and cost efforts for implementing to a minimum and provides device manufacturers with a fast, easy and cost-saving integration of a PROFINET IO device interface.
Renesas Electronics, a leading provider of ultra-modern semiconductor solutions, and Phoenix Contact enter into a strategic partnership. Both companies work together in marketing and distributing the PROFINET IO Device Chip TPS-1 developed both by Phoenix Contact and Siemens. The TPS-1 Chip will be available together with the ERTEC 200/400 PROFINET controllers developed by Siemens through worldwide sales channels of Renesas Electronics.
Within the scope of the planned collaboration, Renesas Electronics builds worldwide distribution and customer support for the PROFINET Device Chip TPS-1 via its distribution network. Phoenix Contact will be responsible for the maintenance and further development of the software components associated with the TPS-1 PROFINET Chip and provide support in answering system-related questions regarding PROFINET and the realization of special customer-specific solutions.