Package Information
| CAD Model: | View CAD Model |
| Pkg. Type: | TQFN |
| Pkg. Code: | KM |
| Lead Count (#): | 20 |
| Pkg. Dimensions (mm): | 2.0 x 3.0 |
| Pitch (mm): | 0.4 |
Environmental & Export Classifications
| Moisture Sensitivity Level (MSL) | 1 |
| Pb (Lead) Free | Yes |
| ECCN (US) | EAR99 |
| HTS (US) | 8542.39.0090 |
Product Attributes
| Lead Count (#) | 20 |
| Carrier Type | Tape & Reel |
| Moisture Sensitivity Level (MSL) | 1 |
| Pb (Lead) Free | Yes |
| Temp. Range (°C) | -40 to +85°C |
| Country of Assembly | TAIWAN |
| Country of Wafer Fabrication | TAIWAN |
| # of Programable Delays (#) | 1 |
| ACMP Channels (#) | 2 |
| Additional Features | Supported in Go Configure™ Software Hub |
| CNT/DLY (Max) (#) | 5 |
| D Flip-flops (DFFs) (#) | 15 |
| DCMP | - |
| GPIOs (#) | 12 |
| Interface | I2C |
| LUTs (Max) (#) | 17 |
| Longevity | 2035 Jun |
| MOQ | 3000 |
| Memory Type | OTP |
| Nominal VDD | 2.3 - 5.5 |
| Oscillator Type | LF OSC, Ring OSC |
| Outputs (#) | 4 |
| Pattern Generator | 1 |
| Peak Output Current IPK (A) | 2 |
| Pipe Delay | 16-stage |
| Pitch (mm) | 0.4 |
| Pkg. Dimensions (mm) | 2.0 x 3.0 |
| Pkg. Type | TQFN |
| Price (USD) | $0.96084 |
| Qty. per Reel (#) | 3000 |
| Special Features | 2x CCMP, 2x H-/4x Half-Bridge, 2x PWM, Int&Diff Amp |
| Temperature Sensor (ch) (#) | 1 |
| VDD2 (V) | 3 - 13.2 |
Resources for SLG47105
Description
The SLG47105 combines mixed-signal logic and high-voltage H-bridge functionality in a tiny 2mm x 3mm QFN package. A one-time programmable (OTP) non-volatile memory (NVM) stores user-defined solutions in the form of interconnections of internal logic, I/O pins, and macrocells. Integrated dual H-Bridge/quad Half-Bridge functionality allows driving different loads up to 2A per output with up to 13.2V voltage. The SLG47105 advanced PWM macrocells provide the ability to drive multiple motors with different PWM frequencies and duty cycles. Low idle current consumption in combination with a compact size further extends the field of possible applications. This highly versatile device allows for a wide variety of mixed-signal functions to be designed alongside high-voltage capabilities within a tiny and thermally efficient IC.