NEW
Lead Count (#) | 16 |
Pkg. Type | TQFN |
Pitch (mm) | 0.4 |
Pkg. Dimensions (mm) | 2.0 x 2.0 |
Pb (Lead) Free | Yes |
Moisture Sensitivity Level (MSL) | 1 |
ECCN (US) | |
HTS (US) |
Pkg. Type | TQFN |
Lead Count (#) | 16 |
Pb (Lead) Free | Yes |
Temp. Range | -40 to +105°C |
Country of Assembly | China, Taiwan |
Country of Wafer Fabrication | Taiwan |
# of Programable Delays (#) | 1 |
ACMP Channels (#) | 1 |
Additional Features | Supported in Go Configure™ Software Hub |
CNT/DLY (Max) (#) | 15 |
Carrier Type | Tape & Reel |
DCMP | 1 |
DFF (Max) (#) | 31 |
GPIOs (#) | 14 |
Interface | I2C, SPI |
LUTs (Max) (#) | 31 |
Look-up Table (LUTs) | 31 |
Memory Type | OTP |
Moisture Sensitivity Level (MSL) | 1 |
Nominal VDD | 1.71-3.6 |
Oscillator Type | LF OSC, Ring OSC |
Pipe Delay | 6x 8-bit Shift Regs |
Pitch (mm) | 0.4 |
Pkg. Dimensions (mm) | 2.0 x 2.0 |
Qty. per Reel (#) | 3000 |
Special Features | ADC (14-bit, SAR), DAC (12-bit), PGA 1x-64x, Math Core, 4k x 12-bit RAM, 1x PWM |
Temperature Sensor (ch) (#) | 1 |
The SLG47011-E provides a small, low power solution for commonly used analog-to-digital conversion and mixed-signal functions. A flexible data acquisition system used in conjunction with configurable logic provides a way to implement a wide variety of functions with minimal cost. The user can create a circuit design by programming the one-time programmable (OTP) Non-Volatile Memory (NVM), to configure the interconnect logic, the macrocells, and the IO pins.