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Package Information
| Lead Count (#) | 14 |
| Pkg. Type | TQFN |
| Pkg. Dimensions (mm) | 2.0 x 2.2 |
Environmental & Export Classifications
| Pb (Lead) Free | Yes |
| Moisture Sensitivity Level (MSL) | |
| ECCN (US) | |
| HTS (US) |
Product Attributes
| Pkg. Type | TQFN |
| Lead Count (#) | 14 |
| Pb (Lead) Free | Yes |
| Temp. Range | -40 to +105°C |
| Country of Assembly | China, Taiwan |
| Country of Wafer Fabrication | Taiwan |
| # of Programable Delays (#) | 1 |
| ACMP Channels (#) | 3 |
| Additional Features | Supported in Go Configure™ Software Hub |
| CNT/DLY (Max) (#) | 7 |
| Carrier Type | Tape & Reel |
| DFF (Max) (#) | 15 |
| GPIOs (#) | 12 |
| Interface | I2C |
| LUTs (Max) (#) | 25 |
| Look-up Table (LUTs) | 25 |
| Memory Type | OTP |
| Nominal VDD | 1.71-5.5 |
| Oscillator Type | Conf. OSC, Ring OSC |
| Pattern Generator | 1 |
| Pipe Delay | 16-stage |
| Pkg. Dimensions (mm) | 2.0 x 2.2 |
Resources for SLG46536-E
Description
The SLG46536-E provides a small, low-power component for commonly used mixed-signal functions. The user creates their circuit design by programming the one-time programmable (OTP) non-volatile memory (NVM) to configure the interconnect logic, the IO pins, and the macrocells of the SLG46536-E. This highly versatile device allows for a wide variety of mixed-signal functions to be designed within a very small, low-power single integrated circuit.