Pitch (mm) | 0.8 |
Lead Count (#) | 196 |
Pkg. Type | LFBGA |
Pkg. Dimensions (mm) | 12 x 12 x 1.43 |
Pkg. Code | pkg_20094 |
Moisture Sensitivity Level (MSL) | 3 |
ECCN (US) | 3A991 |
HTS (US) | 8542.31.0025 |
RoHS (R9A07G074M01GBG#AC0) | EnglishJapanese |
Pb (Lead) Free | Yes |
Longevity | 2038 Sep |
Carrier Type | Bulk (Tray) |
Family Name | RZ |
Series Name | RZ/T |
Group Name | T2L |
CPU Architecture | Arm |
Main CPU | Cortex-R52 |
Sub CPU | No |
Floating Point Unit | Double/Single |
Bit Length | 32 |
Program Memory (KB) | 0 |
Data Flash (KB) | 0 |
RAM (KB) | 1024 |
ECC SRAM | Yes |
Lead Count (#) | 196 |
Pkg. Type | LFBGA |
Pitch (mm) | 0.8 |
Pkg. Dimensions (mm) | 12 x 12 x 1.4 |
Number of Supply Voltage(s) (#) | 3 |
Supply Voltage (V) | 3.135 - 3.465 |
I/O Ports | 111 |
DMAC or DTC | DMAC |
DMA (ch) | 32 |
Temperature Sensor (ch) (#) | 1 |
Power-On Reset | No |
Watchdog Timer (ch) | 1 |
External Memory Bus (bit) | 8,16 |
DRAM I/F | SDRAM |
3D GPU | No |
Accelerator | No |
Temp. Range | Tj = -40 to +125°C |
External Interrupt Pins (#) | 16 |
LVD or PVD | No |
Operating Freq (Max) (MHz) | 800 |
Operating Freq of Sub CPU (Max) | 0 |
Sub-clock (32.768 kHz) | Yes |
On-chip Oscillator | Yes |
Ethernet speed | 10M/100M/1G |
Ethernet (ch) | 1 |
EtherCat (ch) (#) | 0 |
USB Ports (#) | 1 |
USB FS (host ch/device ch) | ( 1 / 1 ) |
USB HS (host ch/device ch) | ( 1 / 1 ) |
USB SS (host ch/device ch) | ( 0 / 0 ) |
PCI Express (generation and ch) | No |
SCI or UART (ch) | 6 |
SPI (ch) | 4 |
QSPI (ch) | 2 |
OSPI (ch) | 2 |
I2C (#) | 3 |
I3C (ch) | 0 |
CAN (ch) | 2 |
CAN-FD (ch) | 0 |
Wireless | No |
IrDA | No |
LIN (#) | 0 |
SDHI (ch) | 0 |
High Resolution Output Timer | No |
PWM Output (pin#) | 25 |
32-Bit Timer (ch) | 20 |
16-Bit Timer (ch) (#) | 14 |
8-Bit Timer (ch) | 0 |
Standby operable timer | No |
Asynchronous General Purpose Timer / Interval Timer (ch) | 0 |
RTC | Yes |
16-Bit A/D Converter (ch) | 0 |
14-Bit A/D Converter (ch) | 0 |
12-Bit A/D Converter (ch) | 8 |
10-Bit A/D Converter (ch) | 0 |
24-Bit Sigma-Delta A/D Converter (ch) | 0 |
16-Bit D/A Converter (ch) | 0 |
12-Bit D/A Converter (ch) | 0 |
10-Bit D/A Converter (ch) (#) | 0 |
8-Bit D/A Converter (ch) | 0 |
Analog Comparator (ch) | 0 |
OPAMP (ch) (#) | 0 |
PGA (ch) | 0 |
Capacitive Touch Sensing Unit (ch) | 0 |
Graphics LCD Controller | No |
MIPI Interfaces (DSI) (ch) | 0 |
MIPI Interfaces (CSI) (ch) | 0 |
Camera I/F (Parallel) | No |
Image Codec | No |
2D Drawing Engine | No |
Segment LCD Controller | No |
SSI (ch) | 0 |
Security & Encryption | No |
Debug Interface | JTAG/SWD |
Moisture Sensitivity Level (MSL) | 3 |
Country of Assembly | Taiwan |
Country of Wafer Fabrication | South Korea |
Price (USD) | 1ku | 13.22686 |
12-Bit Timer (ch) | 0 |
32-Bit High Res Timer (ch) | 0 |
ADC | 12-bit x 8-ch |
Asynchronous General Purpose Timer (ch) | 0 |
Bit Size | 32 |
CPU | Cortex-R52 x 1 |
DMA | Yes |
DTC (ch) | 0 |
Ethernet | 10/100M/1G x 1 ch |
Family Name | |
Group Name | |
High-Speed Analog Comparator (ch) | 0 |
Lead Compliant | Yes |
Length (mm) | 12 |
Low-Power Analog Comparator (ch) | 0 |
MOQ | 1 |
Pb (Lead) Free | Yes |
Remarks | Absolute Encoder IF |
SPI (#) | 4 |
Suggested Kits | |
Tape & Reel | No |
Thickness (mm) | 1.4 |
Timer | 16-bit x 8-ch, 32-bit x 18-ch, 16-bit x 6-ch, 32-bit x 2-ch |
UART (#) | 6 |
USB | USB2.0 x 1 ch (1H/F/OTG) |
USBFS (ch) | 0 |
USBHS (ch) | 0 |
Width (mm) | 12 |
RZ/T2L is high-performance MPU that realizes high-speed and high-precision real-time control with EtherCAT. RZ/T2L has Arm® Cortex®-R52 @Max Frequency 800MHz and the large tightly coupled memory size (576 KB) is directly connected to the CPU, reducing the fluctuation in execution time that can occur when cache memory is used, and delivering deterministic and fast-response processing. RZ/T2L has seamless hardware architecture with RZ/T2M such as CPU core, peripheral functions and LLPP (Low Latency Peripheral Port) bus, and can be proposed for higher performance control systems such as AC servo. Also, RZ/T2L offers a scalable and compatible software platform with Renesas MPUs and MCUs. It enables customer utilizing their software assets for new model development.