Features
- CPU: Cortex®-A7 core, Max. 1GHz
- Package: 501-pin HBGA
- Memory: SRAM Max. 332KB
- Timer: 32-bit Timer (ch) x 12, 16-bit Timer (ch) x 4, Watchdog Timer (ch) x 1, Compare match Timer x 10
- PWM: PWM Output x 7
- Analog function
- Others: PLL, Power-On Reset
RZ/G1E Block Diagram
Description
RZ/G1E embedded processors are equipped with a 3D graphics engine (PowerVR SGX540 at 260MHz) and support full high-definition video encoding and decoding, making them ideal for human machine interface (HMI) applications.
Applications
- Connectivity
- Human Machine Interface
- Industrial Network
| Part Number | Status | Samples | Stock | RoHS | Package | Budgetary Price (USD) | Carrier Type | Family Name | Series Name | Group Name | CPU Architecture | Main CPU | Sub CPU | Floating Point Unit | Bit Length | Program Memory (KB) | Data Flash (KB) | RAM (KB) | ECC SRAM | Lead Count (#) | Pitch (mm) | Pkg. Dimensions (mm) | Number of Supply Voltage(s) (#) | Supply Voltage (V) | I/O Ports | DMAC or DTC | DMA (ch) | Temperature Sensor (ch) (#) | Power-On Reset | Watchdog Timer (ch) | External Memory Bus (bit) | DRAM I/F | NPU | 3D GPU | Accelerator | MOQ | Temp. Range (°C) | External Interrupt Pins (#) | LVD or PVD | Operating Freq (Max) (MHz) | Sub-clock (32.768 kHz) | On-chip Oscillator | Ethernet speed | Ethernet (ch) | EtherCat (ch) (#) | USB Ports (#) | USB FS (host ch/device ch) | USB HS (host ch/device ch) | USB SS (host ch/device ch) | PCI Express (generation and ch) | SCI or UART (ch) | SPI (ch) | QSPI (ch) | OSPI (ch) | I2C (#) | I3C (ch) | CAN (ch) | CAN-FD (ch) | Wireless | IrDA | LIN (#) | SDHI (ch) | High Resolution Output Timer | PWM Output (pin#) | 32-Bit Timer (ch) | 16-Bit Timer (ch) (#) | 8-Bit Timer (ch) | Standby operable timer | Asynchronous General Purpose Timer / Interval Timer (ch) | RTC | 16-Bit A/D Converter (ch) | 14-Bit A/D Converter (ch) | 12-Bit A/D Converter (ch) | 10-Bit A/D Converter (ch) | 24-Bit Sigma-Delta A/D Converter (ch) | 16-Bit D/A Converter (ch) | 12-Bit D/A Converter (ch) | 10-Bit D/A Converter (ch) (#) | 8-Bit D/A Converter (ch) | Analog Comparator (ch) | OPAMP (ch) (#) | PGA (ch) | Capacitive Touch Sensing Unit (ch) | Graphics LCD Controller | MIPI Interfaces (DSI) (ch) | MIPI Interfaces (CSI) (ch) | Camera I/F (Parallel) | Image Codec | 2D Drawing Engine | Segment LCD Controller | SSI (ch) | Security & Encryption | Debug Interface | Moisture Sensitivity Level (MSL) | Country of Assembly | Country of Wafer Fabrication |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| R8A77450HA02BG#UA | NRND | N/A | In Stock | RoHS:EN RoHS:JA | FCBGA | 1ku | $21.11 | Bulk (Tray) | RZ | RZ/G | G1E | Arm | Cortex-A7 x 2 | No | Double | 32 | 0 | 0 | 332KB | No | 501# | 0.8mm | 21 x 21 x 2.4 | 3# | 3 - 3.6 | 208 | DMAC | 30 | 0 | No | 1 | 32 | DDR3-1333 (32-bit) | No | PowerVR SGX540 | Video Codec | 1 | Ta = -40 to +85 | 8# | No | 1000MHz | No | No | 10M/100M | 1ch | 0 | 2# | ( 1 / 1 ) | ( 1 / 1 ) | ( 0 / 0 ) | No | 18 | 3 | 0 | 1 | 7# | 0 | 2 | 0 | No | No | 0 | 3 | No | 0 | 14 | 4# | 0 | No | 0 | No | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | No | 0 | 0 | No | H.264 enc/dec | No | No | 10ch | No | JTAG/SWD | 3 | JAPAN | TAIWAN |
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- Release NotePDF 332 KB R01TU0271EJ0123 Rev.1.23 Dec 26, 2025
- Release NotePDF 608 KB R01TU0269EJ0127 Rev.1.27 Dec 26, 2025
- Release NotePDF 661 KB R01TU0270EJ0123 Rev.1.23 Dec 26, 2025
- Manual - SoftwarePDF 1.19 MB R01US0553EJ0118 Rev.1.18 Aug 22, 2025The RZ/G Verified Linux Package release note provides details on software updates, supported features, resolved issues, and known limitations for the current Linux package. It enables developers to track version changes and ensure stable integration of the RZ/G platform into embedded Linux systems.
- Manual - SoftwarePDF 672 KB R01TU0269EJ0126 Rev.1.26 Aug 22, 2025
- Technical UpdatePDF 1.02 MB TN-RZ*-A0113B/E Jun 16, 2025
- GuidePDF 5.05 MB R01US0648EJ0107 Rev.1.07 Mar 31, 2025The Linux Start-up Guide offers step-by-step instructions for preparing the development environment, setting up the board, booting the system, and performing initial operations. It helps developers quickly evaluate the RZ/G1H, M, N, and E devices and begin application development with proven embedded features.
- Manual - SoftwarePDF 201 KB R01TU0271EJ0122 Rev.1.22 Dec 25, 2024
- Manual - SoftwarePDF 534 KB R01TU0270EJ0122 Rev.1.22 Dec 25, 2024
- Application NoteAI-generated Summary: The document explains how to integrate and use IAR Systems compilers within the e² studio development environment for Renesas microcontrollers. It details the installation of IAR Embedded Workbench and IAR Eclipse plugins, project creation, build configuration, and build execution using IAR compilers. The guide focuses on the RA family with the IAR ARM compiler but applies similarly to other Renesas devices. It also recommends using standalone Flexible Software Package configurators for RA and RZ families to enhance development. The environment setup assumes Windows 10 64-bit, e² studio 2024-07, and IAR tools installed.
- Technical UpdatePDF 233 KB TN-RZ*-A0116A/E Aug 31, 2023
- Technical UpdatePDF 210 KB TN-RZ*-A0115A/E Aug 31, 2023
- Technical UpdatePDF 223 KB TN-RZ*-A0114A/E Aug 31, 2023
- Manual - HardwareRZ/G Series User's Manual: HardwareRECOMMENDEDZIP 51.7 MB R01UH0543EJ0100 Rev.1.00 Sep 30, 2016
- Manual - HardwareRZ/G1E User's Manual: HardwareRECOMMENDEDPDF 1.42 MB R01UH0544EJ0100 Rev.1.00 Sep 30, 2016
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- Manual - SoftwarePDF 1.19 MB R01US0553EJ0118 Rev.1.18 Aug 22, 2025The RZ/G Verified Linux Package release note provides details on software updates, supported features, resolved issues, and known limitations for the current Linux package. It enables developers to track version changes and ensure stable integration of the RZ/G platform into embedded Linux systems.
- Manual - SoftwarePDF 672 KB R01TU0269EJ0126 Rev.1.26 Aug 22, 2025
- GuidePDF 5.05 MB R01US0648EJ0107 Rev.1.07 Mar 31, 2025The Linux Start-up Guide offers step-by-step instructions for preparing the development environment, setting up the board, booting the system, and performing initial operations. It helps developers quickly evaluate the RZ/G1H, M, N, and E devices and begin application development with proven embedded features.
- Manual - SoftwarePDF 201 KB R01TU0271EJ0122 Rev.1.22 Dec 25, 2024View More (9)
Manuals & Guides (9)
- Release NotePDF 332 KB R01TU0271EJ0123 Rev.1.23 Dec 26, 2025
- Release NotePDF 608 KB R01TU0269EJ0127 Rev.1.27 Dec 26, 2025
- Release NotePDF 661 KB R01TU0270EJ0123 Rev.1.23 Dec 26, 2025
- Application NoteAI-generated Summary: The document explains how to integrate and use IAR Systems compilers within the e² studio development environment for Renesas microcontrollers. It details the installation of IAR Embedded Workbench and IAR Eclipse plugins, project creation, build configuration, and build execution using IAR compilers. The guide focuses on the RA family with the IAR ARM compiler but applies similarly to other Renesas devices. It also recommends using standalone Flexible Software Package configurators for RA and RZ families to enhance development. The environment setup assumes Windows 10 64-bit, e² studio 2024-07, and IAR tools installed.
- Application NoteAI-generated Summary: This guide explains how to create and build CMake projects using e² studio. It covers installing necessary tools such as e² studio, CMake, and GNU Make, creating a new CMake project, and configuring the builder by disabling the default CDT Core Builder and adding CMake and Make commands. The instructions include setting up environment variables and specifying CMake command parameters to generate native build files from platform-independent CMakeLists.txt configurations.View More (10)
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- Technical UpdatePDF 1.02 MB TN-RZ*-A0113B/E Jun 16, 2025
- Technical UpdatePDF 233 KB TN-RZ*-A0116A/E Aug 31, 2023
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- Technical UpdatePDF 223 KB TN-RZ*-A0114A/E Aug 31, 2023
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Partner Boards & Kits
Complementary Silicon Devices
DRAM & Flash Memory Solutions
Provides a comprehensive external memory solution for Renesas RZ and R‑Car families, supporting systems that require scalable off‑chip memory. Supported memory types include Serial NAND (Quad/Octal SPI, 512Mb to 8Gb, 1.8V and 3.3V, 100K/60K cycle endurance), ONFI NAND (ONFI 1.0, 1Gb to 8Gb, 1.8V and 3.3V, 100K/60K cycle endurance), DRAM (DDR2/3/4 from 512Mb to 32Gb and LPDDR2/3/4/4x/5/5x from 1Gb to 16Gb), and HyperRAM™ (HyperBus, 64Mb to 512Mb, 1.8V and 1.2V).
Provided By:
Winbond Electronics Corp. Japan
SoM/SBC
RZ/G1E SODIMM System on Module
The Renesas RZ/G1E SODIMM system on module (SoM) integrates the Renesas RZ/G1E MPU featuring dual Arm® Cortex®-A7 processors running up to 1GHz, with 3D graphics and HD video encode/decode support. The module includes 512MB DDR3 memory (expandable) and up to 8 GB eMMC storage. Designed in a 67.6mm×37mm SODIMM form factor, it provides interfaces such as Gigabit Ethernet, USB 2.0, CAN, SPI, I²C, UART, camera, and RGB display, making it suitable for industrial HMI, digital signage, and embedded multimedia applications.
Supported Products:
RZ/G1EProvided By:
iWave Global