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RMLV1616A-U Block Diagram
3D illustration featuring top and bottom views of TSOP(1) chip package with 48 lead count.
RMLV1616A-U Block Diagram
3D illustration featuring top and bottom views of TSOP(1) chip package with 48 lead count.

RMLV1616AGSA-4U2#KA0

Active
16Mbit LPSRAM (1M word × 16-bit/2M word x 8-bit)
RMLV1616A-U Series DatasheetEOL plan of R1LV1616H series with development of alternative products (Revised)Learn more about RMLV1616A-U

Package Information

CAD Model:View CAD Model
Pkg. Type:TSOP(48)
Pkg. Code:pkg_11788
Lead Count (#):48
Pkg. Dimensions (mm):18 x 12 x 1.2
Pitch (mm):0.5

Environmental & Export Classifications

Moisture Sensitivity Level (MSL)3
ECCN (US)3A991.b.2.a
HTS (US)8542.32.0041
Pb (Lead) FreeYes

Product Attributes

Pkg. TypeTSOP(48)
Carrier TypeEmbossed Tape
Moisture Sensitivity Level (MSL)3
Country of AssemblyTAIWAN
Country of Wafer FabricationJAPAN
Access Time (ns)55
Density (Kb)16000
Lead CompliantYes
Lead Count (#)48
Length (mm)18
MOQ1000
Memory Capacity (kbit)16000
Memory Density16
Organization1M x 16
Organization (bit)x 8 / x 16
Organization (kword)2000
Pb (Lead) FreeYes
Pkg. Dimensions (mm)18 x 12 x 1.2
Price (USD)$16.17
RemarksDual Chip Select (CS1#, CS2)
Supply Voltage (V)2.7 - 3.6
Tape & ReelNo
Temp. Range (°C)-40 to +85
Thickness (mm)1.2
Width (mm)12

Description

The RMLV1616A-U Series is a family of 16Mbit asynchronous SRAMs organized 1,048,576-word × 16-bit.

The RMLV1616A-U Series realizes higher soft error immunity compared to typical SRAMs with on-chip ECC, achieved by Renesas’ unique Advanced LPSRAM technologies. Therefore, it is suitable for battery backup systems.

It is offered in a 48-pin TSOP (I) or 48-ball fine pitch ball grid array.

Learn more about RMLV1616A-U