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Package Information
| CAD Model: | View CAD Model |
| Pkg. Type: | WAFER |
| Pkg. Code: | DICEW |
| Lead Count (#): | |
| Pkg. Dimensions (mm): | 0.0 x 0.0 x 0.0 |
| Pitch (mm): |
Environmental & Export Classifications
| Moisture Sensitivity Level (MSL) | |
| Pb (Lead) Free | Yes |
| ECCN (US) | |
| HTS (US) |
Product Attributes
| Pkg. Type | WAFER |
| Lead Count (#) | 0 |
| Carrier Type | WFP |
| Pb (Lead) Free | Yes |
| Pb Free Category | e3 Sn |
| Temp. Range (°C) | -5 to 105°C |
| 3dB Bandwidth (GHz) | 90 |
| Application | 800G and beyond coherent systems with 128Gbaud QAM |
| Channels (#) | 4 |
| Country of Wafer Fabrication | USA |
| Data Rate Max (Gbps) | 128 |
| Function | Linear TIA |
| MOQ | 70 |
| Peaking Frequency (Typical) (GHz) | 73 |
| Pkg. Dimensions (mm) | 0.0 x 0.0 x 0.0 |
| Price (USD) | $462 |
| Qty. per Carrier (#) | 0 |
| Qty. per Reel (#) | 0 |
| Tape & Reel | No |
Resources for RG8G31420
Description
The RG8G31420 is a 128Gbaud linear transimpedance amplifier (TIA) chip that integrates four lanes of TIAs for XI, XQ, YI, and YQ channels. It has a digital interface circuitry for DC controls on a single die for 800G and beyond coherent applications. The TIA electrical characteristics, functionality, and physical dimensions are designed for optical subassemblies such as micro‑ICR and IC‑TROSA in small‑form‑factor (SFF) integrated optical modules.