Package Information
| Lead Count (#) | 52 |
| Pkg. Code | pkg_712 |
| Pkg. Type | LQFP |
| Pkg. Dimensions (mm) | 10 x 10 x 1.7 |
Environmental & Export Classifications
| ECCN (US) | 3A991 |
| RoHS (R5F21247SDFP#X6) | EnglishJapanese |
| Moisture Sensitivity Level (MSL) | 3 |
| Pb (Lead) Free | Yes |
| HTS (US) |
Product Attributes
| RAM (KB) | 2.5 |
| Lead Count (#) | 52 |
| Temp. Range | -40 to +85°C |
| ADC | 10-bit x 12-ch |
| Bit Size | 16 |
| CPU | R8C |
| DMA | No |
| Data Flash (KB) | 0 |
| Ethernet | No |
| Family Name | R8C |
| I/O Ports | 41 |
| LVD or PVD | Yes |
| Lead Compliant | Yes |
| Length (mm) | 10 |
| MOQ | 1500 |
| Moisture Sensitivity Level (MSL) | 3 |
| Operating Freq (Max) (MHz) | 20 |
| Pb (Lead) Free | Yes |
| Pkg. Dimensions (mm) | 10 x 10 x 1.7 |
| Pkg. Type | LQFP |
| Program Memory (KB) | 48 |
| RTC | Yes |
| Supply Voltage (V) | 2.2 - 5.5 |
| Tape & Reel | No |
| Thickness (mm) | 1.7 |
| Timer | 8-bit x 3-ch, 16-bit x 2-ch |
| Width (mm) | 10 |
Description
The R8C/24 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.
This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level of instruction efficiency. With 1Mb of address space, it is capable of executing instructions at high speed. This MCU is equipped with one CAN module and suited to in-vehicle or FA networking. Furthermore, the data flash (1KB x 2 blocks) is embedded in the R8C/23 Group. The difference between R8C/22 and R8C/23 Groups is only the existence of the data flash. Their peripheral functions are the same.