Features
- Highly integrated power management IC
- Efficient high-frequency integrated FET switching regulators
- Integrated regulators to produce core, graphics, and system agent rails
- Extensive fault protection
- Overcurrent, overvoltage, and over-temperature protection
- Temperature alert signal
- SVID I2C bus allows system fault monitoring, enables control
- Output voltage offset programming through SVID I2C
Description
The ISL95862 is a Power Management Integrated Circuit (PMIC) for ultrabook, notebook, and tablet computers powered by 2-cell Li-ion batteries. It integrates control, MOSFET drivers, power MOSFETs, fault protection, and fault monitoring functions for three highly efficient synchronous buck regulators. Integrated into one package are the regulators for the core, graphics, and system agent voltages. The ISL95862 is offered in a thermally efficient 8mmx12mm, 96 bump, 0. 5mm pitch WLCSP package. The PMIC regulators convert the system voltage from a battery or adapter into the three necessary processor voltages required by Intel’s IMVP8 specifications. The switching regulators operate at high frequency and are based on Intersil’s proprietary R3™ Technology, which provides high light-load efficiency and fast transient response with minimal external compensation. The PMIC provides overcurrent, overvoltage, and over-temperature fault protections. The controller also features a temperature alert signal that indicates when the PMIC is operating at an elevated temperature. An ALERT signal provides notice of any fault or warning outside of the temperature alert signal. The PMIC also offers I2C capability compatible with Intel’s SMBus specification.
| Part Number | Status | Samples | Stock | Package | Lead Count (#) | Carrier Type | Moisture Sensitivity Level (MSL) | Pb (Lead) Free | Pb Free Category | Temp. Range (°C) |
|---|---|---|---|---|---|---|---|---|---|---|
| ISL95862HIZ-T | Obsolete | N/A | In Stock | WLCSP-TCURDL | 96# | Reel | 1 | Yes | Pb-Free Ball Terminal (SAC-Q)-e6 | -10 to +100°C |
| ISL95862IIZ-T | Obsolete | N/A | Out of Stock | WLCSP-TCURDL | 96# | Reel | 1 | Yes | Pb-Free Ball Terminal (SAC-Q)-e6 | -40 to +85°C |
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- Application NotePDF 397 KB an1684 Jan 19, 2004AI-generated Summary: The document outlines important legal disclaimers and usage guidelines for semiconductor products. It emphasizes user responsibility for product design and safety, disclaims liability for damages, and clarifies no intellectual property licenses are granted. Products are categorized by quality grades with specific application recommendations. Users must comply with laws, avoid unauthorized modifications, and ensure safe use within specified conditions. Contact details for Renesas Electronics sales offices worldwide are provided.
- Application NotePDF 509 KB an1681 Jan 19, 2004AI-generated Summary: The document explains grounding techniques for PCB layouts using a dual op amp example on a single-layer copper board. It compares three grounding schemes: a center spine ground trace, an outer ground plane, and a split/star ground plane, highlighting the benefits of single-point grounding to minimize noise and antenna effects. It emphasizes following current paths, minimizing loop lengths, and ensuring close forward and return paths to reduce interference. The document also includes disclaimers on product use, quality grades, safety, and legal compliance.
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- Application NotePDF 397 KB an1684 Jan 19, 2004AI-generated Summary: The document outlines important legal disclaimers and usage guidelines for semiconductor products. It emphasizes user responsibility for product design and safety, disclaims liability for damages, and clarifies no intellectual property licenses are granted. Products are categorized by quality grades with specific application recommendations. Users must comply with laws, avoid unauthorized modifications, and ensure safe use within specified conditions. Contact details for Renesas Electronics sales offices worldwide are provided.
- Application NotePDF 509 KB an1681 Jan 19, 2004AI-generated Summary: The document explains grounding techniques for PCB layouts using a dual op amp example on a single-layer copper board. It compares three grounding schemes: a center spine ground trace, an outer ground plane, and a split/star ground plane, highlighting the benefits of single-point grounding to minimize noise and antenna effects. It emphasizes following current paths, minimizing loop lengths, and ensuring close forward and return paths to reduce interference. The document also includes disclaimers on product use, quality grades, safety, and legal compliance.
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