Features
- Adjustable Delay to Subsequent Enable Signal
- Adjustable Delay to Sequence Auto Start
- Adjustable Distributed Voltage Monitoring
- Under and Overvoltage Adjustable Delay to Auto Start Sequence
- I/O Options
- ENABLE (ISL8700, ISL8702) and ENABLE# (ISL8701) SEQ_EN (ISL8702)
- Voltage Compliance Fault Output
- Pb-Free (RoHS Compliant)
Description
The ISL8700, ISL8701, ISL8702 family of ICs provide four delay adjustable sequenced outputs while monitoring an input voltage all with a minimum of external components. High performance DSP, FPGA, µP and various subsystems require input power sequencing for proper functionality at initial power-up and the ISL870X provides this function while monitoring the distributed voltage for over and undervoltage compliance. The ISL8700 and ISL8701 operate over the +2. 5V to +24V nominal voltage range, whereas the ISL8702 operates over the 2. 5V to +12V range. All three have a user adjustable time from UV and OV voltage compliance to sequencing start via an external capacitor when in auto start mode and adjustable time delay to subsequent ENABLE output signal via external resistors. Additionally, the ISL8702 provides an input for sequencing on and off operation (SEQ_EN) and for voltage window compliance reporting (FAULT) over the +2. 5V to +12V voltage range. Easily daisy chained for more than 4 sequenced signals. Altogether, the ISL870X provides these adjustable features with a minimum of external BOM. See Figure 1 for typical implementation.
Applications
- Power Supply Sequencing
- System Timing Function
| Part Number | Status | Samples | Stock | RoHS | Package | Lead Count (#) | Carrier Type | Moisture Sensitivity Level (MSL) | Pb (Lead) Free | Pb Free Category | Temp. Range (°C) |
|---|---|---|---|---|---|---|---|---|---|---|---|
| ISL8702IBZ | Obsolete | N/A | In Stock | RoHS:EN | SOIC | 14# | Tube | 2 | Yes | Pb-Free 100% Matte Tin Plate w/Anneal-e3 | -40 to +85°C |
| ISL8702IBZ-T | Obsolete | N/A | In Stock | RoHS:EN | SOIC | 14# | Reel | 2 | Yes | Pb-Free 100% Matte Tin Plate w/Anneal-e3 | -40 to +85°C |
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- Product Change NoticePDF 266 KB Jun 04, 2020
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- Product Change NoticePDF 77 KB PCN13026 Apr 01, 2013
- Product Change NoticePDF 207 KB PCN13013 Mar 19, 2013
- Product Change NoticePDF 108 KB PCN12068 Aug 21, 2012
- Application NotePDF 397 KB an1684 Jan 19, 2004AI-generated Summary: The document outlines important legal disclaimers and usage guidelines for semiconductor products. It emphasizes user responsibility for product design and safety, disclaims liability for damages, and clarifies no intellectual property licenses are granted. Products are categorized by quality grades with specific application recommendations. Users must comply with laws, avoid unauthorized modifications, and ensure safe use within specified conditions. Contact details for Renesas Electronics sales offices worldwide are provided.
- Application NotePDF 509 KB an1681 Jan 19, 2004AI-generated Summary: The document explains grounding techniques for PCB layouts using a dual op amp example on a single-layer copper board. It compares three grounding schemes: a center spine ground trace, an outer ground plane, and a split/star ground plane, highlighting the benefits of single-point grounding to minimize noise and antenna effects. It emphasizes following current paths, minimizing loop lengths, and ensuring close forward and return paths to reduce interference. The document also includes disclaimers on product use, quality grades, safety, and legal compliance.
Recommended Documents (1)
Datasheets (1)
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- Application NotePDF 397 KB an1684 Jan 19, 2004AI-generated Summary: The document outlines important legal disclaimers and usage guidelines for semiconductor products. It emphasizes user responsibility for product design and safety, disclaims liability for damages, and clarifies no intellectual property licenses are granted. Products are categorized by quality grades with specific application recommendations. Users must comply with laws, avoid unauthorized modifications, and ensure safe use within specified conditions. Contact details for Renesas Electronics sales offices worldwide are provided.
- Application NotePDF 509 KB an1681 Jan 19, 2004AI-generated Summary: The document explains grounding techniques for PCB layouts using a dual op amp example on a single-layer copper board. It compares three grounding schemes: a center spine ground trace, an outer ground plane, and a split/star ground plane, highlighting the benefits of single-point grounding to minimize noise and antenna effects. It emphasizes following current paths, minimizing loop lengths, and ensuring close forward and return paths to reduce interference. The document also includes disclaimers on product use, quality grades, safety, and legal compliance.
Application Notes & White Papers (2)
- Product Change NoticePDF 266 KB Jun 04, 2020
- Product Change NoticePDF 398 KB PCN15046 Jan 07, 2016
- Product Change NoticePDF 77 KB PCN13026 Apr 01, 2013
- Product Change NoticePDF 207 KB PCN13013 Mar 19, 2013View More (6)
Product Notices (PCN, EOL, etc) (6)
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