Features
- Fully-encapsulated dual step-down switching power supply
- Up to 100W output from a 17mmx17mm PCB footprint
- Dual 20A or single 40A output
- Up to 94% conversion efficiency
- 4.5V to 20V input voltage range
- 0.6V to 2.5V output voltage range
- 1.5% output voltage accuracy with differential remote sensing
- Output overvoltage, overcurrent and over-temperature protection
- QFN package with exposed leads permits easy probing and visual solder inspection
ISL8240M Functional Diagram
Description
The ISL8240M is a fully-encapsulated step-down switching power supply that can deliver up to 100W output power from a small 17mmx17mm PCB footprint. The two 20A outputs may be used independently or combined to deliver a single output of 40A. Designing a high-performance board-mounted power supply has never been simpler -- only a few external components are needed to create a very dense and reliable power solution. 1. 5% output voltage accuracy, differential remote voltage sensing and fast transient response create a very high-performance power system. Built-in output overvoltage, overcurrent and over-temperature protection enhance system reliability. The ISL8240M is available in a thermally-enhanced QFN package. Excellent efficiency and low thermal resistance permit full power operation without heat sinks or fans. In addition, the QFN package with external leads permits easy probing and visual solder inspection.
Applications
- Computing, networking and telecom infrastructure
- equipment
- Industrial and medical equipment
- General purpose point-of-load (POL) power
| Part Number | Status | Samples | Stock | Package | Lead Count (#) | Carrier Type | Moisture Sensitivity Level (MSL) | Pb (Lead) Free | Pb Free Category | Temp. Range (°C) |
|---|---|---|---|---|---|---|---|---|---|---|
| ISL8240MIRZ | Obsolete | N/A | Out of Stock | Module | 26# | Tray | 4 | Exempt | Pb-Free 100% Matte Tin Plate w/Anneal-e3 | -40 to +125°C |
| ISL8240MIRZ-T | Obsolete | N/A | Out of Stock | Module | 26# | Reel | 4 | Exempt | Pb-Free 100% Matte Tin Plate w/Anneal-e3 | -40 to +125°C |
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- Product Change NoticePDF 398 KB PCN15046 Jan 07, 2016
- Application NotePDF 397 KB an1684 Jan 19, 2004AI-generated Summary: The document outlines important legal disclaimers and usage guidelines for semiconductor products. It emphasizes user responsibility for product design and safety, disclaims liability for damages, and clarifies no intellectual property licenses are granted. Products are categorized by quality grades with specific application recommendations. Users must comply with laws, avoid unauthorized modifications, and ensure safe use within specified conditions. Contact details for Renesas Electronics sales offices worldwide are provided.
- Application NotePDF 509 KB an1681 Jan 19, 2004AI-generated Summary: The document explains grounding techniques for PCB layouts using a dual op amp example on a single-layer copper board. It compares three grounding schemes: a center spine ground trace, an outer ground plane, and a split/star ground plane, highlighting the benefits of single-point grounding to minimize noise and antenna effects. It emphasizes following current paths, minimizing loop lengths, and ensuring close forward and return paths to reduce interference. The document also includes disclaimers on product use, quality grades, safety, and legal compliance.
- DocumentPDF 980 KB tb488 Jul 10, 2002
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- Application NotePDF 397 KB an1684 Jan 19, 2004AI-generated Summary: The document outlines important legal disclaimers and usage guidelines for semiconductor products. It emphasizes user responsibility for product design and safety, disclaims liability for damages, and clarifies no intellectual property licenses are granted. Products are categorized by quality grades with specific application recommendations. Users must comply with laws, avoid unauthorized modifications, and ensure safe use within specified conditions. Contact details for Renesas Electronics sales offices worldwide are provided.
- Application NotePDF 509 KB an1681 Jan 19, 2004AI-generated Summary: The document explains grounding techniques for PCB layouts using a dual op amp example on a single-layer copper board. It compares three grounding schemes: a center spine ground trace, an outer ground plane, and a split/star ground plane, highlighting the benefits of single-point grounding to minimize noise and antenna effects. It emphasizes following current paths, minimizing loop lengths, and ensuring close forward and return paths to reduce interference. The document also includes disclaimers on product use, quality grades, safety, and legal compliance.
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- Product Change NoticePDF 398 KB PCN15046 Jan 07, 2016
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