Features
- Fully-encapsulated dual step-down switching power supply
- Up to 100W output from a 17mmx17mm square PCB footprint
- Dual 15A or single 30A output
- Up to 95% conversion efficiency
- 4.5V to 20V input voltage range
- 0.6V to 7.5V output voltage range
- 1.5% output voltage accuracy with differential remote sensing
- Up to six modules may be paralleled to support 180A output current
- Output overvoltage, overcurrent and over-temperature protection
- Full power operation without heat sinks or fans
- QFN package with exposed leads permits easy probing and visual solder inspection
Description
The ISL8225M is a fully-encapsulated step-down switching power supply that can deliver up to 100W output power from a small 17mm square PCB footprint. The two 15A outputs may be used independently or combined to deliver a single 30A output. Designing a high-performance board mounted power supply has never been simpler -- only a few external components are needed to create a very dense and reliable power solution. Automatic current sharing and phase interleaving allow up to six modules to be paralleled for 180A output capability. 1. 5% output voltage accuracy, differential remote voltage sensing and fast transient response create a very high-performance power system. Built-in output overvoltage, overcurrent and over-temperature protection enhance system reliability. The ISL8225M is available in a thermally-enhanced QFN package. Excellent efficiency and low thermal resistance permit full power operation without heat sinks or fans. In addition, the QFN package with external leads permits easy probing and visual solder inspection.
Applications
- Computing, networking and telecom infrastructure equipment
- Industrial and medical equipment
- General purpose point-of-load (POL) power
| Part Number | Status | Samples | Stock | Package | Lead Count (#) | Carrier Type | Moisture Sensitivity Level (MSL) | Pb (Lead) Free | Pb Free Category | Temp. Range (°C) |
|---|---|---|---|---|---|---|---|---|---|---|
| ISL8225MIRZ | Obsolete | N/A | Out of Stock | Module | 26# | Tray | 4 | Exempt | Pb-Free 100% Matte Tin Plate w/Anneal-e3 | -40 to +125°C |
| ISL8225MIRZ-T | Obsolete | N/A | Out of Stock | Module | 26# | Reel | 4 | Exempt | Pb-Free 100% Matte Tin Plate w/Anneal-e3 | -40 to +125°C |
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- Product Change NoticePDF 398 KB PCN15046 Jan 07, 2016
- Application NotePDF 397 KB an1684 Jan 19, 2004AI-generated Summary: The document outlines important legal disclaimers and usage guidelines for semiconductor products. It emphasizes user responsibility for product design and safety, disclaims liability for damages, and clarifies no intellectual property licenses are granted. Products are categorized by quality grades with specific application recommendations. Users must comply with laws, avoid unauthorized modifications, and ensure safe use within specified conditions. Contact details for Renesas Electronics sales offices worldwide are provided.
- Application NotePDF 509 KB an1681 Jan 19, 2004AI-generated Summary: The document explains grounding techniques for PCB layouts using a dual op amp example on a single-layer copper board. It compares three grounding schemes: a center spine ground trace, an outer ground plane, and a split/star ground plane, highlighting the benefits of single-point grounding to minimize noise and antenna effects. It emphasizes following current paths, minimizing loop lengths, and ensuring close forward and return paths to reduce interference. The document also includes disclaimers on product use, quality grades, safety, and legal compliance.
- DocumentPDF 980 KB tb488 Jul 10, 2002
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- Application NotePDF 397 KB an1684 Jan 19, 2004AI-generated Summary: The document outlines important legal disclaimers and usage guidelines for semiconductor products. It emphasizes user responsibility for product design and safety, disclaims liability for damages, and clarifies no intellectual property licenses are granted. Products are categorized by quality grades with specific application recommendations. Users must comply with laws, avoid unauthorized modifications, and ensure safe use within specified conditions. Contact details for Renesas Electronics sales offices worldwide are provided.
- Application NotePDF 509 KB an1681 Jan 19, 2004AI-generated Summary: The document explains grounding techniques for PCB layouts using a dual op amp example on a single-layer copper board. It compares three grounding schemes: a center spine ground trace, an outer ground plane, and a split/star ground plane, highlighting the benefits of single-point grounding to minimize noise and antenna effects. It emphasizes following current paths, minimizing loop lengths, and ensuring close forward and return paths to reduce interference. The document also includes disclaimers on product use, quality grades, safety, and legal compliance.
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- Product Change NoticePDF 398 KB PCN15046 Jan 07, 2016
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