Features
- Complete switch mode power supply in one package
- ISL8204M - 4A with, 6.6A Peak
- ISL8206M - 6A with, 8.8A Peak
- Single resistor sets VOUT +0.6V up to +6V at ±1%
- Up to 95% efficiency
- Overcurrent protection
- Internal soft-start with pre-bias output start-up
- Wide input voltage range from 1VDC to 20VDC
- Fast transient response
Description
The ISL8204M, ISL8206M is a family of pin-compatible power modules to the ISL8201M. These are simple and easy to use, high power DC/DC modules and are ideal for a wide variety of applications. The ISL820xM family of high current DC/DC step-down modules virtually eliminate design and manufacturing risks while dramatically improving time to market. The simplicity is in the family's Off The Shelf unassisted implementation. All you need is the ISL820xM for the current requirement of your design, bulk input and output capacitors and one resistor, to program the output voltage, and you have a complete high current power design ready for your market. This family of buck converters is packaged in a thermally enhanced compact (15mmx15mm) overmolded QFN Package that operates without a heatsink, even at full load over temperature. The package supports simple, reliable, automated assembly using standard surface mount equipment while making it easy to probe to all pins. The lack of a required heat dissipation layer, provides easy access to all pins and the limited number of the external components reduce the PCB to a component layer and a simple ground layer. Additionally, each IC in the family is footprint compatible, making it easy to change your design to meet different power needs without changing your layout. One simple layout fits all.
Applications
- Servers
- Telecom and Datacom Applications
- Industrial Equipment
- Point of Load Regulation
- General Purpose Step-Down DC/DC
| Part Number | Status | Samples | Stock | Package | Lead Count (#) | Carrier Type | Moisture Sensitivity Level (MSL) | Pb (Lead) Free | Pb Free Category | Temp. Range (°C) |
|---|---|---|---|---|---|---|---|---|---|---|
| ISL8204MIRZ | Obsolete | N/A | Out of Stock | Module | 15# | Tray | 3 | Exempt | Pb-Free 100% Matte Tin Plate w/Anneal-e3 | -40 to +85°C |
| ISL8204MIRZ-T | Obsolete | N/A | Out of Stock | Module | 15# | Reel | 3 | Exempt | Pb-Free 100% Matte Tin Plate w/Anneal-e3 | -40 to +85°C |
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- Product Change NoticePDF 398 KB PCN15046 Jan 07, 2016
- Product Change NoticePDF 98 KB PCN14057 Nov 26, 2014
- Product Change NoticePDF 102 KB PCN12066 Aug 08, 2012
- Application NotePDF 397 KB an1684 Jan 19, 2004AI-generated Summary: The document outlines important legal disclaimers and usage guidelines for semiconductor products. It emphasizes user responsibility for product design and safety, disclaims liability for damages, and clarifies no intellectual property licenses are granted. Products are categorized by quality grades with specific application recommendations. Users must comply with laws, avoid unauthorized modifications, and ensure safe use within specified conditions. Contact details for Renesas Electronics sales offices worldwide are provided.
- Application NotePDF 509 KB an1681 Jan 19, 2004AI-generated Summary: The document explains grounding techniques for PCB layouts using a dual op amp example on a single-layer copper board. It compares three grounding schemes: a center spine ground trace, an outer ground plane, and a split/star ground plane, highlighting the benefits of single-point grounding to minimize noise and antenna effects. It emphasizes following current paths, minimizing loop lengths, and ensuring close forward and return paths to reduce interference. The document also includes disclaimers on product use, quality grades, safety, and legal compliance.
- DocumentPDF 980 KB tb488 Jul 10, 2002
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- Application NotePDF 397 KB an1684 Jan 19, 2004AI-generated Summary: The document outlines important legal disclaimers and usage guidelines for semiconductor products. It emphasizes user responsibility for product design and safety, disclaims liability for damages, and clarifies no intellectual property licenses are granted. Products are categorized by quality grades with specific application recommendations. Users must comply with laws, avoid unauthorized modifications, and ensure safe use within specified conditions. Contact details for Renesas Electronics sales offices worldwide are provided.
- Application NotePDF 509 KB an1681 Jan 19, 2004AI-generated Summary: The document explains grounding techniques for PCB layouts using a dual op amp example on a single-layer copper board. It compares three grounding schemes: a center spine ground trace, an outer ground plane, and a split/star ground plane, highlighting the benefits of single-point grounding to minimize noise and antenna effects. It emphasizes following current paths, minimizing loop lengths, and ensuring close forward and return paths to reduce interference. The document also includes disclaimers on product use, quality grades, safety, and legal compliance.
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- Product Change NoticePDF 398 KB PCN15046 Jan 07, 2016
- Product Change NoticePDF 98 KB PCN14057 Nov 26, 2014
- Product Change NoticePDF 102 KB PCN12066 Aug 08, 2012
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