Features
- Electrically screened to SMD 5962-11213
- QML qualified per MIL-PRF-38535 requirements
- TID Rad Hard Assurance (RHA) testing
- Low dose rate (0.01rad(Si)/s): 50krad(Si)
- SEE hardness (see SEE report for details)
- No DSEE for VDD = 6.5V and 86MeV•cm2/mg
- Precision supply voltage monitor
- 4.65V threshold in the ISL7x5AxH/BxH/CxH
- 200ms (typical) reset pulse width
- Active high, active low, and open-drain options
- Independent watchdog timer with 1.6s (typical) timeout
- Precision threshold detector
- 1.25V threshold in the ISL7x5AxH/BxH/CxH
- Debounced TTL/CMOS compatible manual-reset input
- Reset output valid at VDD = 1.2V
ISL705xxH/ISL706xxH Functional Diagram
Description
The devices in this family are radiation hardened 5.0V/3.3V supervisory circuits that reduce the complexity required to monitor supply voltages in microprocessor systems. These devices significantly improve accuracy and reliability relative to discrete solutions. Each IC provides four key functions: A reset output during power-up, power-down and brownout conditions, an independent watchdog output that goes low if the watchdog input has not been toggled within 1.6s, a precision threshold detector for monitoring a power supply other than VDD, and an active-low, manual-reset input.
Parameters
| Attributes | Value |
|---|---|
| Rating | Space |
| Reset Output Type | Active Low Push-Pull |
| Supply Voltage (min) (V) | 1.2 - 1.2 |
| Supply Voltage (max) (V) | 3.6 - 3.6 |
| Precision Threshold Detector (V) | 0.6 |
| Temp. Range (°C) | -55 to +125°C |
| TID LDR (krad(Si)) | 50 |
| DSEE (MeV·cm2/mg) | 86 |
| Flow | RH Hermetic |
| Qualification Level | Class V, EM |
| Die Sale Availability? | Yes |
| PROTO Availability? | Yes |
Applications
- Supervisor for microprocessors, microcontrollers, FPGAs, and DSPs
- Critical power supply monitoring
- Reliable replacement of discrete solutions
| Part Number | Status | Samples | Stock | Package | Lead Count (#) | Carrier Type | Moisture Sensitivity Level (MSL) | Qualification Level | DLA SMD | Pb (Lead) Free | Pb Free Category | MOQ | Temp. Range (°C) | CAGE code |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| ISL736AEHF/PROTO | Active | Available | Out of Stock | CFP | 8# | Tray | Not Applicable | EM | Exempt | Gold Plate over compliant Undercoat-e4 | 1 | -55 to +125°C | 34371 | |
| ISL736AEHVF | Active | N/A | In Stock | CFP | 8# | Tray | Not Applicable | Class V | 5962L1121320VXC | Exempt | Gold Plate over compliant Undercoat-e4 | 25 | -55 to +125°C | 34371 |
| ISL736AEHVX | Active | N/A | Out of Stock | DIE | Class V | 5962L1121320V9A | No | 100 | -55 to +125°C | 34371 | ||||
| ISL736AEHX/SAMPLE | Active | N/A | Out of Stock | DIE | EM | No | 5 | -55 to +125°C | 34371 |
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- ReportPDF 290 KB TR035 Apr 30, 2026
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- ReportPDF 260 KB R34ET0009EU0200 Rev.2.00 Dec 05, 2019
- ReportPDF 511 KB R34ET0008EU0200 Rev.2.00 Dec 05, 2019
- Model - SPICEZIP 726 KB isl705xrh_isl706xrh_spice_files Nov 17, 2017
- Application NotePDF 267 KB an1710 Nov 09, 2011AI-generated Summary: The pages present detailed simulation application schematics for ISL705xRH and ISL706xRH series, including component values, connections, and configurations for proper operation. They illustrate resistor values, capacitor placements, transistor types, and voltage levels essential for circuit design. Additionally, a legal disclaimer outlines Renesas’ terms of use, warranty disclaimers, and intellectual property rights. Contact and trademark information is also provided.
- Application NotePDF 338 KB an9867 Nov 10, 1999AI-generated Summary: Electrical parameters are monitored during life testing to detect drift and failures, defined by exceeding datasheet limits. New products require less than 1% failure during burn-in, with failure analysis and corrective actions if exceeded. Sampling plans ensure defect rates below 3%. Life tests last 1000-3000 hours at 125°C depending on process maturity. Failure mechanisms include electromigration, ionic contamination, hot carrier injection, and dielectric rupture. Product sign-off requires all parties' approval after reliability confirmation. Space products undergo burn-in and quality conformance inspections with strict failure limits. Derating is unnecessary as datasheet limits are set at 6-sigma from characterization data, ensuring reliability.
- Application NotePDF 224 KB an9654 May 05, 1999AI-generated Summary: The document explains the reliability and failure mechanisms of semiconductor parts, focusing on life testing and wearout. It discusses how switching states cause transient current pulses and hot carrier injection, which only occur briefly during switching. Life testing at elevated temperatures accelerates aging to remove infant mortality failures, improving reliability. The failure rate follows a bathtub curve with infant mortality, useful life, and wearout phases, modeled by lognormal and exponential distributions. The Arrhenius equation relates failure rates at different temperatures. Burn-in and life tests reduce early failures without harming intrinsic reliability.
- ReportPDF 1.62 MB an1651 Jan 19, 2004
- DatasheetPDF 961 KB FN7662 Mar 14, 2025
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- DatasheetPDF 961 KB FN7662 Mar 14, 2025
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- Application NotePDF 267 KB an1710 Nov 09, 2011AI-generated Summary: The pages present detailed simulation application schematics for ISL705xRH and ISL706xRH series, including component values, connections, and configurations for proper operation. They illustrate resistor values, capacitor placements, transistor types, and voltage levels essential for circuit design. Additionally, a legal disclaimer outlines Renesas’ terms of use, warranty disclaimers, and intellectual property rights. Contact and trademark information is also provided.
- Application NotePDF 338 KB an9867 Nov 10, 1999AI-generated Summary: Electrical parameters are monitored during life testing to detect drift and failures, defined by exceeding datasheet limits. New products require less than 1% failure during burn-in, with failure analysis and corrective actions if exceeded. Sampling plans ensure defect rates below 3%. Life tests last 1000-3000 hours at 125°C depending on process maturity. Failure mechanisms include electromigration, ionic contamination, hot carrier injection, and dielectric rupture. Product sign-off requires all parties' approval after reliability confirmation. Space products undergo burn-in and quality conformance inspections with strict failure limits. Derating is unnecessary as datasheet limits are set at 6-sigma from characterization data, ensuring reliability.
- Application NotePDF 224 KB an9654 May 05, 1999AI-generated Summary: The document explains the reliability and failure mechanisms of semiconductor parts, focusing on life testing and wearout. It discusses how switching states cause transient current pulses and hot carrier injection, which only occur briefly during switching. Life testing at elevated temperatures accelerates aging to remove infant mortality failures, improving reliability. The failure rate follows a bathtub curve with infant mortality, useful life, and wearout phases, modeled by lognormal and exponential distributions. The Arrhenius equation relates failure rates at different temperatures. Burn-in and life tests reduce early failures without harming intrinsic reliability.
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