Features
- Provides 2 ACPI-Controlled Voltages
- 5VDUAL USB/Keyboard/Mouse
- 3.3VDUAL/3.3VSB PCI/Auxiliary/LAN
- Excellent 3.3VDUAL Regulation in S3/S4/S5
- ±2.0% Over-Temperature
- 1A Capability on ISL6506A
- 2A Capability on ISL6506B
- Small Size; Very Low External Component Count
- Over-Temperature Shutdown
- Pb-Free Available (RoHS Compliant)
Description
The ISL6506A and ISL6506B complement other power building blocks (voltage regulators) in ACPI-compliant designs for microprocessor and computer applications. They integrate the control of the 5VDUAL and 3. 3VDUAL rails into an 8 Ld EPAD SOIC package. The ISL6506A and ISL6506B's operating mode (active outputs or sleep outputs) is selectable through two digital control pins; S3 and S5. A completely integrated linear regulator generates the 3. 3VDUAL voltage plane from the ATX supply's 5VSB output during sleep states (S3, S4/S5). In active states (during S0 and S1/S2), the ISL6506A and ISL6506B use an external N-Channel pass MOSFET to connect the outputs directly to the 3. 3V input supplied by an ATX power supply, for minimal losses. The ISL6506A and ISL6506B power up the 5VDUAL plane by switching in the ATX 5V output through an NMOS transistor in active states, or by switching in the ATX 5VSB through a PMOS (or PNP) transistor in S3 sleep state. In S4/S5 sleep states, the ISL6506B 5VDUAL output is shut down. In the ISL6506A, the 5VDUAL output stays on during S4/S5 sleep states. The ISL6506A and ISL6506B are functionally identical, except for the sleep mode in the preceding paragraph. In addition, the ISL6506A has a 1A current limit on the internal 3. 3V LDO; the ISL6506B has a 2A current limit.
Parameters
| Attributes | Value |
|---|---|
| Qualification Level | Standard |
| Temp. Range (°C) | 0 to +70°C |
Package Options
| Pkg. Type | Pkg. Dimensions (mm) | Lead Count (#) | Pitch (mm) |
|---|---|---|---|
| SOICN-EP | 4.9 x 3.9 x 0.00 | 8 | 1.3 |
Applications
- ACPI-Compliant Power Regulation for Motherboards
| Part Number | Status | Samples | Stock | RoHS | Package | Budgetary Price (USD) | Lead Count (#) | Carrier Type | Moisture Sensitivity Level (MSL) | Pb (Lead) Free | Pb Free Category | Temp. Range (°C) | Country of Assembly | Country of Wafer Fabrication |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| ISL6506BCBZ-T | Active | Available | In Stock | RoHS:EN | SOICN-EP | 1ku | $1 | 8# | Reel | 3 | Yes | Pb-Free 100% Matte Tin Plate w/Anneal-e3 | 0 to +70°C | CHINA, PHILIPPINES, CHINA | USA |
| ISL6506BCBZ | Obsolete | N/A | In Stock | RoHS:EN | SOICN-EP | 8# | Tube | 3 | Yes | Pb-Free 100% Matte Tin Plate w/Anneal-e3 | 0 to +70°C | |||
| ISL6506BCBZA | Obsolete | N/A | Out of Stock | RoHS:EN | SOICN-EP | 8# | Tube | 3 | Yes | Pb-Free 100% Matte Tin Plate w/Anneal-e3 | 0 to +70°C | |||
| ISL6506BCBZA-T | Obsolete | N/A | Out of Stock | RoHS:EN | SOICN-EP | 8# | Reel | 3 | Yes | Pb-Free 100% Matte Tin Plate w/Anneal-e3 | 0 to +70°C |
Filters
Applied Filters
- Product AdvisoryPDF 314 KB PA19027 Aug 09, 2019
- Product Change NoticePDF 51 KB PCN10047 May 12, 2010
- Application NotePDF 397 KB an1684 Jan 19, 2004AI-generated Summary: The document outlines important legal disclaimers and usage guidelines for semiconductor products. It emphasizes user responsibility for product design and safety, disclaims liability for damages, and clarifies no intellectual property licenses are granted. Products are categorized by quality grades with specific application recommendations. Users must comply with laws, avoid unauthorized modifications, and ensure safe use within specified conditions. Contact details for Renesas Electronics sales offices worldwide are provided.
- Application NotePDF 509 KB an1681 Jan 19, 2004AI-generated Summary: The document explains grounding techniques for PCB layouts using a dual op amp example on a single-layer copper board. It compares three grounding schemes: a center spine ground trace, an outer ground plane, and a split/star ground plane, highlighting the benefits of single-point grounding to minimize noise and antenna effects. It emphasizes following current paths, minimizing loop lengths, and ensuring close forward and return paths to reduce interference. The document also includes disclaimers on product use, quality grades, safety, and legal compliance.
Recommended Documents (1)
Datasheets (1)
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- Application NotePDF 397 KB an1684 Jan 19, 2004AI-generated Summary: The document outlines important legal disclaimers and usage guidelines for semiconductor products. It emphasizes user responsibility for product design and safety, disclaims liability for damages, and clarifies no intellectual property licenses are granted. Products are categorized by quality grades with specific application recommendations. Users must comply with laws, avoid unauthorized modifications, and ensure safe use within specified conditions. Contact details for Renesas Electronics sales offices worldwide are provided.
- Application NotePDF 509 KB an1681 Jan 19, 2004AI-generated Summary: The document explains grounding techniques for PCB layouts using a dual op amp example on a single-layer copper board. It compares three grounding schemes: a center spine ground trace, an outer ground plane, and a split/star ground plane, highlighting the benefits of single-point grounding to minimize noise and antenna effects. It emphasizes following current paths, minimizing loop lengths, and ensuring close forward and return paths to reduce interference. The document also includes disclaimers on product use, quality grades, safety, and legal compliance.
Application Notes & White Papers (2)
- Product AdvisoryPDF 314 KB PA19027 Aug 09, 2019
- Product Change NoticePDF 51 KB PCN10047 May 12, 2010
Product Notices (PCN, EOL, etc) (2)
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