Features
- VR12 Serial Communications Bus
- Precision Voltage Regulation
- 5mV Steps with VID Fast/Slow Slew Rates
- Supports Two Current Sensing Methods
- Lossless Inductor DCR Current Sensing
- Precision Resistor Current Sensing
- Programmable 1, 2 or 3-Phase Operation
- Adaptive Body Diode Conduction Time Reduction
- Superior Noise Immunity and Transient Response
- Pin Programmable Output Voltage and Power State Mode
- Output Current Monitor and Thermal Monitor
- Differential Remote Voltage Sensing
- High Efficiency Across Entire Load Range
- Programmable Switching Frequency
- Resistor Programmable VBOOT, Power State Operation, SVID Address Setting, IMAX
- Excellent Dynamic Current Balance Between Phases
- OCP/WOC, OVP, OT Alert, PGOOD
- Small Footprint 40 Ld 5x5 TQFN Package
- Pb-Free (RoHS Compliant)
Description
The ISL6353 is a three-phase PWM buck regulator controller for VR12 DDR memory applications. The multi-phase implementation results in better system performance, superior thermal management, lower component cost and smaller PCB area. The ISL6353 has two integrated power MOSFET drivers for implementing a cost effective and space saving power management solution. The PWM modulator of the ISL6353 is based on Renesas' Robust Ripple Regulator™ (R3) technology. Compared with the traditional multi-phase buck regulator, the R3 modulator commands variable PWM switching frequency during load transients, achieving faster transient response. R3 also naturally goes into pulse frequency modulation operation in light load conditions to achieve higher light load efficiency. The ISL6353 is designed to be completely compliant with VR12 specifications. The ISL6353 has a serial VID (SVID) bus communicating with the CPU. The output can be programmed for 1-, 2- or 3-phase interleaved operation. The output voltage and power state can also be controlled independent of the serial VID bus. The ISL6353 has several other key features. It supports DCR current sensing with a single NTC thermistor for DCR temperature compensation or accurate resistor current sensing. It also has remote voltage sense, adjustable switching frequency, current monitor, OC/OV protection and power-good. Temperature monitor and thermal alert is available too.
Parameters
| Attributes | Value |
|---|---|
| Outputs (Max) (#) | 1 |
| Phases (Max) | 3 |
| Input Voltage (Min) (V) | 4.5 |
| Input Voltage (Max) (V) | 25 |
| Output Voltage (Max) (V) | 1.52 |
| Output Current (Max) [Rail 1] (A) | 120 |
| Bias Voltage Range (V) | 4.75 - 5.25 |
| Parametric Applications | VR12 DDR Memory Systems |
| Qualification Level | Standard |
| Temp. Range (°C) | 0 to +70°C |
Package Options
| Pkg. Type | Pkg. Dimensions (mm) | Lead Count (#) | Pitch (mm) |
|---|---|---|---|
| TQFN | 5.0 x 5.0 x 0.75 | 40 | 0.4 |
Applications
- DDR Memory
| Part Number | Status | Samples | Stock | RoHS | Package | Budgetary Price (USD) | Lead Count (#) | Carrier Type | Moisture Sensitivity Level (MSL) | Pb (Lead) Free | Pb Free Category | Temp. Range (°C) | Country of Assembly | Country of Wafer Fabrication |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| ISL6353CRTZ-T | Active | Available | Out of Stock | RoHS:EN | TQFN | 1ku | $3.81 | 40# | Reel | 3 | Yes | Pb-Free 100% Matte Tin Plate w/Anneal-e3 | 0 to +70°C | MALAYSIA, TAIWAN | TAIWAN |
| ISL6353CRTZ | Last Time Buy | N/A | In Stock | RoHS:EN | TQFN | 1ku | $3.81 | 40# | Tube | 3 | Yes | Pb-Free 100% Matte Tin Plate w/Anneal-e3 | 0 to +70°C | MALAYSIA, TAIWAN | TAIWAN |
| ISL6353CRTZ-TK | Last Time Buy | N/A | In Stock | RoHS:EN | TQFN | 1ku | $3.81 | 40# | Reel | 3 | Yes | Pb-Free 100% Matte Tin Plate w/Anneal-e3 | 0 to +70°C | MALAYSIA, TAIWAN | TAIWAN |
| ISL6353IRTZ | Last Time Buy | N/A | In Stock | RoHS:EN | TQFN | 1ku | $3.15 | 40# | Tube | 3 | Yes | Pb-Free 100% Matte Tin Plate w/Anneal-e3 | -40 to +85°C | MALAYSIA, TAIWAN | TAIWAN |
| ISL6353IRTZ-T | Last Time Buy | N/A | In Stock | RoHS:EN | TQFN | 1ku | $3.15 | 40# | Reel | 3 | Yes | Pb-Free 100% Matte Tin Plate w/Anneal-e3 | -40 to +85°C | MALAYSIA, TAIWAN | TAIWAN |
Filters
Applied Filters
- Product Change NoticePDF 326 KB May 21, 2021
- Product Change NoticePDF 183 KB PCN13024 Mar 07, 2013
- Application NotePDF 397 KB an1684 Jan 19, 2004AI-generated Summary: The document outlines important legal disclaimers and usage guidelines for semiconductor products. It emphasizes user responsibility for product design and safety, disclaims liability for damages, and clarifies no intellectual property licenses are granted. Products are categorized by quality grades with specific application recommendations. Users must comply with laws, avoid unauthorized modifications, and ensure safe use within specified conditions. Contact details for Renesas Electronics sales offices worldwide are provided.
- Application NotePDF 509 KB an1681 Jan 19, 2004AI-generated Summary: The document explains grounding techniques for PCB layouts using a dual op amp example on a single-layer copper board. It compares three grounding schemes: a center spine ground trace, an outer ground plane, and a split/star ground plane, highlighting the benefits of single-point grounding to minimize noise and antenna effects. It emphasizes following current paths, minimizing loop lengths, and ensuring close forward and return paths to reduce interference. The document also includes disclaimers on product use, quality grades, safety, and legal compliance.
Recommended Documents (1)
Datasheets (1)
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- Application NotePDF 397 KB an1684 Jan 19, 2004AI-generated Summary: The document outlines important legal disclaimers and usage guidelines for semiconductor products. It emphasizes user responsibility for product design and safety, disclaims liability for damages, and clarifies no intellectual property licenses are granted. Products are categorized by quality grades with specific application recommendations. Users must comply with laws, avoid unauthorized modifications, and ensure safe use within specified conditions. Contact details for Renesas Electronics sales offices worldwide are provided.
- Application NotePDF 509 KB an1681 Jan 19, 2004AI-generated Summary: The document explains grounding techniques for PCB layouts using a dual op amp example on a single-layer copper board. It compares three grounding schemes: a center spine ground trace, an outer ground plane, and a split/star ground plane, highlighting the benefits of single-point grounding to minimize noise and antenna effects. It emphasizes following current paths, minimizing loop lengths, and ensuring close forward and return paths to reduce interference. The document also includes disclaimers on product use, quality grades, safety, and legal compliance.
Application Notes & White Papers (2)
- Product Change NoticePDF 326 KB May 21, 2021
- Product Change NoticePDF 183 KB PCN13024 Mar 07, 2013
Product Notices (PCN, EOL, etc) (4)
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