Features
- Precision Core Voltage Regulation
- 0.5% System Accuracy Over-Temperature
- Enhanced Load Line Accuracy
- Supports Multiple Current Sensing Methods
- Lossless Inductor DCR Current Sensing
- Precision Resistor Current Sensing
- Current Monitor
- Differential Remote Voltage Sensing
- Integrated Gate Driver
- Split LGATE Driver to Increase Light-Load Efficiency (For ISL62881D)
- Adaptive Body Diode Conduction Time Reduction
- User-selectable Overshoot Reduction Function
- Small Footprint 28 Ld 4x4 or 32 Ld 5x5 TQFN Package
Description
The ISL62881C provides a complete solution for microprocessor and graphic processor core power supply with its integrated gate drive. Based on Renesas' Robust Ripple regulator (R3™) technology, the PWM modulator compared to traditional modulators, has faster transient settling time, variable switching frequency during load transients and has improved light load efficiency with its ability to automatically change switching frequency. Fully compliant with IMVP6. 5™, the ISL62881C is easily configurable as a CPU or graphics VCORE controllers by offering: responds to DPRSLPVR signals by entering/exiting diode emulations mode; reports regulator output current via the IMON pin; senses current by using a discrete resistor or the inductor; over-temperature thermal compensation of DCR, using a single NTC thermistor; differential sensing to accurately monitor and adjust processor die voltage; minimizes body diode conduction loss in diode emulation mode with its adaptive body diode conduction time. Need to aggressively reduce the output capacitor? The overshoot reduction function is user-selectable and can be disabled for those concerned about increased system thermal stress. Maintaining all the ISL62881C functions, the ISL62881D offers VR_TT# function for thermal throttling control. It also offers the split LGATE function to further improve light load efficiency.
Applications
- Notebook Core Voltage Regulator
- Notebook GPU Voltage Regulator
| Part Number | Status | Samples | Stock | RoHS | Package | Lead Count (#) | Carrier Type | Moisture Sensitivity Level (MSL) | Pb (Lead) Free | Pb Free Category | Temp. Range (°C) |
|---|---|---|---|---|---|---|---|---|---|---|---|
| ISL62881CHRTZ | Obsolete | N/A | In Stock | RoHS:EN | TQFN | 28# | Tube | 1 | Yes | Pb-Free 100% Matte Tin Plate w/Anneal-e3 | -10 to +100°C |
| ISL62881CHRTZ-T | Obsolete | N/A | Out of Stock | RoHS:EN | TQFN | 28# | Reel | 1 | Yes | Pb-Free 100% Matte Tin Plate w/Anneal-e3 | -10 to +100°C |
| ISL62881CIRTZ | Obsolete | N/A | In Stock | RoHS:EN | TQFN | 28# | Tube | 1 | Yes | Pb-Free 100% Matte Tin Plate w/Anneal-e3 | -40 to +85°C |
| ISL62881CIRTZ-T | Obsolete | N/A | Out of Stock | RoHS:EN | TQFN | 28# | Reel | 1 | Yes | Pb-Free 100% Matte Tin Plate w/Anneal-e3 | -40 to +85°C |
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- PCB Design FilesZIP 3.54 MB isl62881cgpueval2zbom_design Nov 17, 2017
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- Product Change NoticePDF 294 KB PCN14036 Jul 08, 2014
- Product Change NoticePDF 128 KB PCN11036 Apr 14, 2011
- Product Change NoticePDF 248 KB PCN10055 Jun 30, 2010
- Application NotePDF 397 KB an1684 Jan 19, 2004AI-generated Summary: The document outlines important legal disclaimers and usage guidelines for semiconductor products. It emphasizes user responsibility for product design and safety, disclaims liability for damages, and clarifies no intellectual property licenses are granted. Products are categorized by quality grades with specific application recommendations. Users must comply with laws, avoid unauthorized modifications, and ensure safe use within specified conditions. Contact details for Renesas Electronics sales offices worldwide are provided.
- Application NotePDF 509 KB an1681 Jan 19, 2004AI-generated Summary: The document explains grounding techniques for PCB layouts using a dual op amp example on a single-layer copper board. It compares three grounding schemes: a center spine ground trace, an outer ground plane, and a split/star ground plane, highlighting the benefits of single-point grounding to minimize noise and antenna effects. It emphasizes following current paths, minimizing loop lengths, and ensuring close forward and return paths to reduce interference. The document also includes disclaimers on product use, quality grades, safety, and legal compliance.
Recommended Documents (1)
Datasheets (1)
Manuals & Guides (3)
- Application NotePDF 397 KB an1684 Jan 19, 2004AI-generated Summary: The document outlines important legal disclaimers and usage guidelines for semiconductor products. It emphasizes user responsibility for product design and safety, disclaims liability for damages, and clarifies no intellectual property licenses are granted. Products are categorized by quality grades with specific application recommendations. Users must comply with laws, avoid unauthorized modifications, and ensure safe use within specified conditions. Contact details for Renesas Electronics sales offices worldwide are provided.
- Application NotePDF 509 KB an1681 Jan 19, 2004AI-generated Summary: The document explains grounding techniques for PCB layouts using a dual op amp example on a single-layer copper board. It compares three grounding schemes: a center spine ground trace, an outer ground plane, and a split/star ground plane, highlighting the benefits of single-point grounding to minimize noise and antenna effects. It emphasizes following current paths, minimizing loop lengths, and ensuring close forward and return paths to reduce interference. The document also includes disclaimers on product use, quality grades, safety, and legal compliance.
Application Notes & White Papers (2)
- Product Change NoticePDF 294 KB PCN14036 Jul 08, 2014
- Product Change NoticePDF 128 KB PCN11036 Apr 14, 2011View More (6)
Product Notices (PCN, EOL, etc) (6)
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