Features
- 3.3V operation
- Onboard ringing generation
- Low standby power consumption (75V, 65mW)
- Programmable transient current limit
- Improved off-hook software interface
- Integrated MTU DC characteristics
- Low external component count
- Silent polarity reversal
- Pulse metering and on-hook transmission
- Tip open ground start operation
- Balanced and unbalanced ringing
- Thermal shutdown with alarm indicator
- 28 Ld surface mount packaging
- QFN package:
- Compliant to JEDEC PUB95 MO - 220 QFN - Quad flat no leads - Package outline
- Near chip scale package footprint, which improves PCB efficiency and has a thinner profile
- Pb-free available (RoHS compliant)
Description
The 3.3V family of Ringing Subscriber Line Interface Circuits (RSLICs) supports analog Plain Old Telephone Service (POTS) in short and medium loop length, wireless and wireline voice over broadband applications. Ideally suited for customer premise equipment, this family of products offers flexibility to designers with high ringing voltage and low power consumption system requirements. The ISL5585 family is capable of operating with 100V ringing battery supply, which translates directly to the amount of ringing voltage supplied to the subscriber. With the high operating voltage, subscriber loop lengths can be extended to 500Ω (i.e., 5,000 feet) and beyond, allowing this family to serve emerging Fiber In The Loop (FITL) markets. Other key features across the product family include 3.3V VCC operation, low power consumption, ringing using sinusoidal or trapezoidal waveforms, robust auto-detection mechanisms for when subscribers go on or off-hook, and minimal external discrete application components. Integrated test access features are also offered on selected products to support loopback testing as well as line measurement tests. There are ten product offerings of the ISL5585 providing various grades of ringing battery voltage and longitudinal balance.
Applications
- Short loop access platforms
- Voice over Internet Protocol (VoIP)
- Voice over cable and DSL modems
- Internet protocol PBX
- Fiber To The Home (FTTH)
- Remote subscriber units
- Ethernet terminal adapters
| Part Number | Status | Samples | Stock | RoHS | Package | Lead Count (#) | Carrier Type | Moisture Sensitivity Level (MSL) | Pitch (mm) | Pkg. Dimensions (mm) | Pb (Lead) Free | Pb Free Category | Temp. Range (°C) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| ISL5585AIMZ | Obsolete | N/A | Out of Stock | RoHS:EN | PLCC | 28# | Tube | 3 | 1.3mm | 11.4 x 11.4 x 0.00 | Yes | Pb-Free 100% Matte Tin Plate w/Anneal-e3 | -40 to +85°C |
| ISL5585AIMZ-T | Obsolete | N/A | Out of Stock | RoHS:EN | PLCC | 28# | Reel | 3 | 1.3mm | 11.4 x 11.4 x 0.00 | Yes | Pb-Free 100% Matte Tin Plate w/Anneal-e3 | -40 to +85°C |
| ISL5585BIMZ | Obsolete | N/A | In Stock | RoHS:EN | PLCC | 28# | Tube | 3 | 1.3mm | 11.4 x 11.4 x 0.00 | Yes | Pb-Free 100% Matte Tin Plate w/Anneal-e3 | -40 to +85°C |
| ISL5585BIMZ-T | Obsolete | N/A | Out of Stock | RoHS:EN | PLCC | 28# | Reel | 3 | 1.3mm | 11.4 x 11.4 x 0.00 | Yes | Pb-Free 100% Matte Tin Plate w/Anneal-e3 | -40 to +85°C |
| ISL5585CIMZ | Obsolete | N/A | In Stock | RoHS:EN | PLCC | 28# | Tube | 3 | 1.3mm | 11.4 x 11.4 x 0.00 | Yes | Pb-Free 100% Matte Tin Plate w/Anneal-e3 | -40 to +85°C |
| ISL5585CIMZ-T | Obsolete | N/A | Out of Stock | RoHS:EN | PLCC | 28# | Reel | 3 | 1.3mm | 11.4 x 11.4 x 0.00 | Yes | Pb-Free 100% Matte Tin Plate w/Anneal-e3 | -40 to +85°C |
| ISL5585DIMZ | Obsolete | N/A | Out of Stock | RoHS:EN | PLCC | 28# | Tube | 3 | 1.3mm | 11.4 x 11.4 x 0.00 | Yes | Pb-Free 100% Matte Tin Plate w/Anneal-e3 | -40 to +85°C |
| ISL5585DIMZ-T | Obsolete | N/A | Out of Stock | RoHS:EN | PLCC | 28# | Reel | 3 | 1.3mm | 11.4 x 11.4 x 0.00 | Yes | Pb-Free 100% Matte Tin Plate w/Anneal-e3 | -40 to +85°C |
| ISL5585ECMZ | Obsolete | N/A | In Stock | RoHS:EN | PLCC | 28# | Tube | 3 | 1.3mm | 11.4 x 11.4 x 0.00 | Yes | Pb-Free 100% Matte Tin Plate w/Anneal-e3 | 0 to +70°C |
| ISL5585ECMZ-T | Obsolete | N/A | Out of Stock | RoHS:EN | PLCC | 28# | Reel | 3 | 1.3mm | 11.4 x 11.4 x 0.00 | Yes | Pb-Free 100% Matte Tin Plate w/Anneal-e3 | 0 to +70°C |
| ISL5585EVAL4Z | Obsolete | N/A | Out of Stock | Contact | Package | Board Pack | 0.0 x 0.0 x 0.00 | No | |||||
| ISL5585FCMZ | Obsolete | N/A | Out of Stock | RoHS:EN | PLCC | 28# | Tube | 3 | 1.3mm | 11.4 x 11.4 x 0.00 | Yes | Pb-Free 100% Matte Tin Plate w/Anneal-e3 | 0 to +70°C |
| ISL5585FCMZ-T | Obsolete | N/A | Out of Stock | RoHS:EN | PLCC | 28# | Reel | 3 | 1.3mm | 11.4 x 11.4 x 0.00 | Yes | Pb-Free 100% Matte Tin Plate w/Anneal-e3 | 0 to +70°C |
| ISL5585GCMZ | Obsolete | N/A | Out of Stock | RoHS:EN | PLCC | 28# | Tube | 3 | 1.3mm | 11.4 x 11.4 x 0.00 | Yes | Pb-Free 100% Matte Tin Plate w/Anneal-e3 | 0 to +70°C |
| ISL5585GCMZ-T | Obsolete | N/A | Out of Stock | RoHS:EN | PLCC | 28# | Reel | 3 | 1.3mm | 11.4 x 11.4 x 0.00 | Yes | Pb-Free 100% Matte Tin Plate w/Anneal-e3 | 0 to +70°C |
| ISL5585GCRZ | Obsolete | N/A | Out of Stock | RoHS:EN | QFN | 32# | Tube | 3 | 0.5mm | 7.0 x 7.0 x 1.00 | Yes | Pb-Free 100% Matte Tin Plate w/Anneal-e3 | 0 to +70°C |
| ISL5585GCRZ-T | Obsolete | N/A | Out of Stock | RoHS:EN | QFN | 32# | Reel | 3 | 0.5mm | 7.0 x 7.0 x 1.00 | Yes | Pb-Free 100% Matte Tin Plate w/Anneal-e3 | 0 to +70°C |
| ISL5585GCRZ-TK | Obsolete | N/A | Out of Stock | RoHS:EN | QFN | 32# | Reel | 3 | 0.5mm | 7.0 x 7.0 x 1.00 | Yes | Pb-Free 100% Matte Tin Plate w/Anneal-e3 | 0 to +70°C |
Filters
Applied Filters
- Product Change NoticePDF 86 KB PCN12087 Nov 06, 2012
- Application NotePDF 1.24 MB an9640 Jan 10, 2002AI-generated Summary: The content provides a comprehensive glossary of communication terms and acronyms used in telecommunications and networking. It includes definitions for various protocols, standards, technologies, and equipment such as Ethernet versions, ISDN interfaces, cellular systems, modulation schemes, and network components. The glossary explains technical terms like MFLOPS, MIPS, ADSL, AMPS, and many others, offering clear descriptions to aid understanding of communication systems and technologies.
- Application NotePDF 1.9 MB an9922 Feb 06, 2001AI-generated Summary: The document analyzes thermal characteristics and board-level modeling of the RSLIC18 in the MLFP package. It evaluates heat dissipation using various buried copper plane sizes and direct attach thermal vias. Simulations show that increasing heat sink plane area reduces maximum die temperature, but packing density limits thermal performance. Even at 85°C ambient, device temperatures remain safely below the 150°C maximum. FR4 material acts as a thermal barrier, benefiting heat-sensitive components.
- Application NotePDF 569 KB an9824 Jun 01, 2000AI-generated Summary: The SPICE macromodel simulates the RSLIC18 AC loop, modeling four core amplifiers (tip, ring, sense, transmit) with multi-pole circuits and an ideal current mirror for the receiver. It includes low-frequency loop current limit effects. Simulation examples demonstrate resistive and complex load impedance matching, using calculated resistor values to synthesize device impedance. Frequency responses for G42, G24, and G44 configurations are analyzed, showing expected magnitude and phase behavior within the voice band.
- DocumentPDF 653 KB tb379 May 25, 1999
Recommended Documents (1)
Datasheets (1)
Manuals & Guides (1)
- Application NotePDF 1.24 MB an9640 Jan 10, 2002AI-generated Summary: The content provides a comprehensive glossary of communication terms and acronyms used in telecommunications and networking. It includes definitions for various protocols, standards, technologies, and equipment such as Ethernet versions, ISDN interfaces, cellular systems, modulation schemes, and network components. The glossary explains technical terms like MFLOPS, MIPS, ADSL, AMPS, and many others, offering clear descriptions to aid understanding of communication systems and technologies.
- Application NotePDF 1.9 MB an9922 Feb 06, 2001AI-generated Summary: The document analyzes thermal characteristics and board-level modeling of the RSLIC18 in the MLFP package. It evaluates heat dissipation using various buried copper plane sizes and direct attach thermal vias. Simulations show that increasing heat sink plane area reduces maximum die temperature, but packing density limits thermal performance. Even at 85°C ambient, device temperatures remain safely below the 150°C maximum. FR4 material acts as a thermal barrier, benefiting heat-sensitive components.
- Application NotePDF 569 KB an9824 Jun 01, 2000AI-generated Summary: The SPICE macromodel simulates the RSLIC18 AC loop, modeling four core amplifiers (tip, ring, sense, transmit) with multi-pole circuits and an ideal current mirror for the receiver. It includes low-frequency loop current limit effects. Simulation examples demonstrate resistive and complex load impedance matching, using calculated resistor values to synthesize device impedance. Frequency responses for G42, G24, and G44 configurations are analyzed, showing expected magnitude and phase behavior within the voice band.
Application Notes & White Papers (3)
- Product Change NoticePDF 86 KB PCN12087 Nov 06, 2012
Product Notices (PCN, EOL, etc) (3)
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