Features
- This Circuit is Processed in Accordance to MIL-STD- 883 and is Fully Conformant Under the Provisions of Paragraph 1.2.1.
- Full CMOS Design
- Six Transistor Memory Cell
- Low Standby Supply Current 100µA
- Low Operating Supply Current 20mA
- Fast Address Access Time 150ns
- Low Data Retention Supply Voltage 2.0V
- CMOS/TTL Compatible Inputs/Outputs
- JEDEC Approved Pinout
- Equal Cycle and Access Times
- No Clocks or Strobes Required
- Gated Inputs
- No Pull-Up or Pull-Down Resistors Required
- Temperature Range -55°C to +125°C
- Easy Microprocessor Interfacing
- Dual Chip Enable Control
Description
The HM-65642/883 is a CMOS 8192 x 8-bit Static Random Access Memory. The pinout is the JEDEC 28 pin, 8-bit wide standard, which allows easy memory board layouts which accommodate a variety of industry standard ROM, PROM, EPROM, EEPROM and RAMs. The HM-65642/883 is ideally suited for use in microprocessor based systems. In particular, interfacing with the Renesas 80C86 and 80C88 microprocessors is simplified by the convenient output enable (G) input. The HM-65642/883 is a full CMOS RAM which utilizes an array of six transistor (6T) memory cells for the most stable and lowest possible standby supply current over the full military temperature range.
Parameters
| Attributes | Value |
|---|---|
| Rating | MIL-STD-883 |
| Temp. Range (°C) | -55 to +125°C |
| Flow | Harsh Environment & MIL-STD-883 |
| Qualification Level | Class Q |
| Die Sale Availability? | No |
| PROTO Availability? | No |
Package Options
| Pkg. Type | Pkg. Dimensions (mm) | Lead Count (#) | Pitch (mm) |
|---|---|---|---|
| CERDIP | 36.8 x 13.2 x 0.00 | 28 | 2.5 |
| Part Number | Status | Samples | Stock | Package | Lead Count (#) | Carrier Type | Moisture Sensitivity Level (MSL) | Pb (Lead) Free | Pb Free Category | MOQ | Temp. Range (°C) | CAGE code |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| HM1-65642/883 | Active | N/A | Out of Stock | CERDIP | 28# | Tube | Not Applicable | No | Hot Solder Dip | 52 | -55 to +125°C | 34371 |
| HM1-65642B/883 | Active | N/A | In Stock | CERDIP | 28# | Tube | Not Applicable | No | Hot Solder Dip | 39 | -55 to +125°C | 34371 |
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- Product Change NoticePDF 323 KB PCN15064 Dec 22, 2015
- Product Change NoticePDF 174 KB PCN14017 Apr 21, 2014
- Product Change NoticePDF 151 KB PCN11040 Apr 07, 2011
- Application NotePDF 224 KB an9654 May 05, 1999AI-generated Summary: The document explains the reliability and failure mechanisms of semiconductor parts, focusing on life testing and wearout. It discusses how switching states cause transient current pulses and hot carrier injection, which only occur briefly during switching. Life testing at elevated temperatures accelerates aging to remove infant mortality failures, improving reliability. The failure rate follows a bathtub curve with infant mortality, useful life, and wearout phases, modeled by lognormal and exponential distributions. The Arrhenius equation relates failure rates at different temperatures. Burn-in and life tests reduce early failures without harming intrinsic reliability.
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- Application NotePDF 224 KB an9654 May 05, 1999AI-generated Summary: The document explains the reliability and failure mechanisms of semiconductor parts, focusing on life testing and wearout. It discusses how switching states cause transient current pulses and hot carrier injection, which only occur briefly during switching. Life testing at elevated temperatures accelerates aging to remove infant mortality failures, improving reliability. The failure rate follows a bathtub curve with infant mortality, useful life, and wearout phases, modeled by lognormal and exponential distributions. The Arrhenius equation relates failure rates at different temperatures. Burn-in and life tests reduce early failures without harming intrinsic reliability.
Application Notes & White Papers (1)
- Product Change NoticePDF 323 KB PCN15064 Dec 22, 2015
- Product Change NoticePDF 174 KB PCN14017 Apr 21, 2014
- Product Change NoticePDF 151 KB PCN11040 Apr 07, 2011
Product Notices (PCN, EOL, etc) (4)
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