Features
- This Circuit is Processed in Accordance to MIL-STD- 883 and is Fully Conformant Under the Provisions of Paragraph 1.2.1.
- Fast Access Time 70/90ns Max
- Low Standby Current 50µA Max
- Low Operating Current 70mA Max
- Data Retention at 2.0V 20µA Max
- TTL Compatible Inputs and Outputs
- JEDEC Approved Pinout (2716, 6116 Type)
- No Clocks or Strobes Required
- Wide Temperature Range -55°C to +125°C
- Equal Cycle and Access Time
- Single 5V Supply
- Gated Inputs
- No Pull-Up or Pull-Down Resistors Required
Description
The HM-65162/883 is a CMOS 2048 x 8 Static Random Access Memory manufactured using the Renesas Advanced SAJI V process. The device utilizes asynchronous circuit design for fast cycle time and ease of use. The pinout is the JEDEC 24 pin DIP, and 32 pad 8-bit wide standard which allows easy memory board layouts flexible to accommodate a variety of industry standard PROMs, RAMs, ROMs and EPROMs. The HM-65162/883 is ideally suited for use in microprocessor based systems with its 8-bit word length organization. The convenient output enable also simplifies the bus interface by allowing the data outputs to be controlled independent of the chip enable. Gated inputs lower operating current and also eliminate the need for pull-up or pull-down resistors.
Parameters
| Attributes | Value |
|---|---|
| Rating | MIL-STD-883 |
| Temp. Range (°C) | -40 to +85°C, -55 to +125°C |
| Flow | Harsh Environment & MIL-STD-883 |
| Qualification Level | Class Q |
| Die Sale Availability? | No |
| PROTO Availability? | No |
Package Options
| Pkg. Type | Pkg. Dimensions (mm) | Lead Count (#) | Pitch (mm) |
|---|---|---|---|
| CERDIP | 31.8 x 13.2 x 0.00 | 24 | 2.5 |
| Part Number | Status | Samples | Stock | Package | Lead Count (#) | Carrier Type | Moisture Sensitivity Level (MSL) | Pb (Lead) Free | Pb Free Category | MOQ | Temp. Range (°C) | CAGE code |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 8403602JA | Active | N/A | Out of Stock | CERDIP | 24# | Tube | Not Applicable | No | Hot Solder Dip | 60 | -55 to +125°C | 34371 |
| 8403603JA | Active | N/A | In Stock | CERDIP | 24# | Tube | Not Applicable | No | Hot Solder Dip | 75 | -40 to +85°C | 34371 |
| 8403606JA | Active | N/A | Out of Stock | CERDIP | 24# | Tube | Not Applicable | No | Hot Solder Dip | 60 | -55 to +125°C | 34371 |
| HM1-65162/883 | Active | N/A | Out of Stock | CERDIP | 24# | Tube | Not Applicable | No | Hot Solder Dip | 75 | -55 to +125°C | 34371 |
| HM1-65162C/883 | Active | N/A | Out of Stock | CERDIP | 24# | Tube | Not Applicable | No | Hot Solder Dip | 135 | -55 to +125°C | 34371 |
| 29104BJA | Obsolete | N/A | Out of Stock | CERDIP | 24# | Tube | Not Applicable | No | Hot Solder Dip | 30 | -55 to +125°C | 34371 |
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- End Of Life NoticePDF 226 KB PLC16037 Apr 12, 2016
- Product Change NoticePDF 323 KB PCN15064 Dec 22, 2015
- Product Change NoticePDF 174 KB PCN14017 Apr 21, 2014
- Product Change NoticePDF 151 KB PCN11040 Apr 07, 2011
- Application NotePDF 224 KB an9654 May 05, 1999AI-generated Summary: The document explains the reliability and failure mechanisms of semiconductor parts, focusing on life testing and wearout. It discusses how switching states cause transient current pulses and hot carrier injection, which only occur briefly during switching. Life testing at elevated temperatures accelerates aging to remove infant mortality failures, improving reliability. The failure rate follows a bathtub curve with infant mortality, useful life, and wearout phases, modeled by lognormal and exponential distributions. The Arrhenius equation relates failure rates at different temperatures. Burn-in and life tests reduce early failures without harming intrinsic reliability.
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- Application NotePDF 224 KB an9654 May 05, 1999AI-generated Summary: The document explains the reliability and failure mechanisms of semiconductor parts, focusing on life testing and wearout. It discusses how switching states cause transient current pulses and hot carrier injection, which only occur briefly during switching. Life testing at elevated temperatures accelerates aging to remove infant mortality failures, improving reliability. The failure rate follows a bathtub curve with infant mortality, useful life, and wearout phases, modeled by lognormal and exponential distributions. The Arrhenius equation relates failure rates at different temperatures. Burn-in and life tests reduce early failures without harming intrinsic reliability.
Application Notes & White Papers (1)
- End Of Life NoticePDF 226 KB PLC16037 Apr 12, 2016
- Product Change NoticePDF 323 KB PCN15064 Dec 22, 2015
- Product Change NoticePDF 174 KB PCN14017 Apr 21, 2014
- Product Change NoticePDF 151 KB PCN11040 Apr 07, 2011
Product Notices (PCN, EOL, etc) (5)
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