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Microcontrollers for Mobile Device Applications

Package Information

Lead Count (#) 100
Pkg. Code pkg_736
Pkg. Type TFQFP
Pkg. Dimensions (mm) 14 x 14 x 1.2

Environmental & Export Classifications

RoHS (DF2227TE13IV) EnglishJapanese
Moisture Sensitivity Level (MSL)
Pb (Lead) Free Yes
ECCN (US)
HTS (US)

Product Attributes

CPU H8S/2000
Bit Size 16
RAM (KB) 16
Program Memory (KB) 128
Lead Count (#) 100
Operating Freq (Max) (MHz) 13.5
Timer 8-bit x 2-ch, 16-bit x 3-ch
ADC 10-bit x 8-ch
RTC Yes
LVD or PVD No
DMA No
Ethernet No
Temp. Range -40 to +85°C
Family Name H8S
Lead Compliant Yes
Length (mm) 14
MOQ 1
Pb (Lead) Free Yes
Pkg. Dimensions (mm) 14 x 14 x 1.2
Pkg. Type TFQFP
Tape & Reel No
Thickness (mm) 1.2
Width (mm) 14

Description

The H8S/2227 Group is supported only for customers who have already adopted these products. The RX230 is recommended for new designs.