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Microcontrollers for Mobile Device Applications

Package Information

Lead Count (#) 100
Pkg. Code pkg_130
Pkg. Type TFQFP
Pkg. Dimensions (mm) 12 x 12 x 1.2

Environmental & Export Classifications

Moisture Sensitivity Level (MSL) 3
RoHS (DF2218CUTF24V) EnglishJapanese
Pb (Lead) Free Yes
ECCN (US)
HTS (US)

Product Attributes

PLP terminated 2024 Jan (terminated)
CPU H8S/2000
Bit Size 16
RAM (KB) 12
Program Memory (KB) 128
Lead Count (#) 100
Operating Freq (Max) (MHz) 24
Timer 16-bit x 3-ch
ADC 10-bit x 6-ch
RTC Yes
LVD or PVD No
DMA No
Ethernet No
USB USB Peripheral
Temp. Range -20 to +75°C
Moisture Sensitivity Level (MSL) 3
Carrier Type Tray
Family Name H8S
Lead Compliant Yes
Length (mm) 12
MOQ 1
Pb (Lead) Free Yes
Pkg. Dimensions (mm) 12 x 12 x 1.2
Pkg. Type TFQFP
Tape & Reel No
Thickness (mm) 1.2
Width (mm) 12

Description

The H8S/2218 Group is supported only for customers who have already adopted these products. The RX231, RX651 Groups are recommended for new designs.