Package Information
| Lead Count (#) | 112 |
| Pkg. Code | pkg_723 |
| Pkg. Type | LFBGA |
| Pkg. Dimensions (mm) | 10 x 10 x 1.4 |
Environmental & Export Classifications
| ECCN (US) | 3A991 |
| HTS (US) | 8542.31.0001 |
| RoHS (R4F2153VBR25KDV) | EnglishJapanese |
| Moisture Sensitivity Level (MSL) | 3 |
| Pb (Lead) Free | Yes |
Product Attributes
| CPU | H8S/2600 |
| Bit Size | 16 |
| RAM (KB) | 40 |
| Program Memory (KB) | 512 |
| Lead Count (#) | 112 |
| Operating Freq (Max) (MHz) | 25 |
| Timer | 8-bit x 4-ch, 16-bit x 1-ch |
| ADC | 10-bit x 8-ch |
| RTC | No |
| LVD or PVD | No |
| Ethernet | No |
| Temp. Range | -40 to +85°C |
| Country of Assembly | Japan |
| Country of Wafer Fabrication | Japan, Singapore |
| Price (USD) | 1ku | 22.54813 |
| Carrier Type | Tray |
| DMA | No |
| Family Name | H8S |
| Lead Compliant | Yes |
| Length (mm) | 10 |
| MOQ | 1 |
| Moisture Sensitivity Level (MSL) | 3 |
| Pb (Lead) Free | Yes |
| Pkg. Dimensions (mm) | 10 x 10 x 1.4 |
| Pkg. Type | LFBGA |
| Tape & Reel | No |
| Thickness (mm) | 1.4 |
| Width (mm) | 10 |
Description
The H8S/2153 Group is supported only for customers who have already adopted these products. The RX651, RX210 Groups are recommended for new designs.