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SmartBond Bluetooth Low Energy 5.0 SoC with Enhanced Security and Flash

Package Information

CAD Model:View CAD Model
Pkg. Type:AQFN
Pkg. Code:
Lead Count (#):60
Pkg. Dimensions (mm):6 x 6 x 0.8
Pitch (mm):0.55

Environmental & Export Classifications

Moisture Sensitivity Level (MSL)3
Pb (Lead) FreeYes
ECCN (US)3A991.a.2
HTS (US)8542.31.0070
RoHS (DA14682-00F08A92)Download

Product Attributes

Lead Count (#)60
Carrier TypeTape & Reel
Moisture Sensitivity Level (MSL)3
Pb (Lead) FreeYes
Temp. Range (°C)-40 to +85°C
Country of AssemblyTAIWAN
Country of Wafer FabricationTAIWAN
2MbpsNot Supported
ADC10-bit x 8-ch
AoANot Supported
AoDNot Supported
ApplicationRechargeable devices, Charging cases, USB-to-BLE dongles
Bluetooth® MeshOn request
CPUM0
Clock Rate (MHz)96
Execute from FLASHYes
Extended AdvertisingNot Supported
External Rails and Load Capacity3.3V @ 100mA, 1.4V @ 20mA, 1.2V @ 50mA, 1.8V @ 75mA
Flash Memory (KB)1024
Flexible System ClockYes
GATT CachingNot Supported
GPIOs (#)31
Hardware Crypto EngineYes
I2C (#)2
Integrated Battery ChargerYes, 400mA USB charger
Integrated DCDCSIMO Buck DC-DC converter
LE Coded PHY (Long Range)Not Supported
LE Data Length ExtensionsSupported
MCU/MPUM0
MOQ4000
Memory Size (OTP) (KB)64
Operating Freq (Max) (MHz)96
Output Power Range (dBm)0 - 0
Periodic AdvertisingNot Supported
Pitch (mm)0.55
Pkg. Dimensions (mm)6 x 6 x 0.8
Pkg. TypeAQFN
Price (USD)$8.66
Proprietary 2G4 protocolNo
QSPI Interface (#)0
Qty. per Reel (#)4000
RAM (KB)128
ROM (KB)128
Recommended for new DesignsYes
Rx current (mA)3.1
SPI (#)2
Sensitivity (dBm) (dBm)-94
Tx Current (mA)3.4
UART (#)2
USB Ports (#)1
Vcc (V)1.7-4.75
Wireless StandardBLE 5.0 Core specification

Description

The SmartBond™ DA14682 is one of the world's first single-chip solutions for smart home, industrial and wearable devices that meets the enhanced security standards. These highly integrated System-on-Chip (SoC) devices support Bluetooth® 5 and include a range of dedicated features to ensure cutting-edge security for both consumers and developers.

As part of our SmartBond range, the SoC offers industry-leading performance from the lowest power consumption and smallest footprint. Its flexible architecture ensures plenty of processing capacity when you need it while saving power when you don't. It also allows the device to manage multi-sensor arrays and enables always-on sensing.

The device offers extensive memory capacity. The DA14682 includes 8Mbits of onboard Flash, making it ideal for applications with tight space constraints. And, the device allows users to benefit from Over-the-Air (OTA) updates. Built‑in security and IPv6 support ensure reliable, future‑ready connectivity. An ultra‑efficient, highly compact design minimizes power consumption, Bill of Materials (BOM) cost, and system size.

To further simplify development, our SmartSnippets™ software and versatile hardware development kits help users optimize their software for power consumption.