Package Information
| Lead Count (#) | 16 |
| Pitch (mm) | 1.5 |
| Pkg. Type | MODULE |
| Pkg. Dimensions (mm) | 12.5 x 14.5 x 2.8 |
Environmental & Export Classifications
| Moisture Sensitivity Level (MSL) | 3 |
| Pb (Lead) Free | Yes |
| ECCN (US) | EAR99 |
| HTS (US) | 8542.39.90 |
Product Attributes
| Lead Count (#) | 16 |
| Carrier Type | Tape & Reel |
| Moisture Sensitivity Level (MSL) | 3 |
| Qty. per Reel (#) | 1000 |
| Pb (Lead) Free | Yes |
| Temp. Range | -40 to +85°C |
| Country of Assembly | Thailand |
| Country of Wafer Fabrication | Taiwan |
| Price (USD) | 1ku | 3.30639 |
| 2Mbps | Not Supported |
| ADC | 10-bit x 4-ch |
| AoA | Not Supported |
| AoD | Not Supported |
| Application | Asset tracking, Beacons, Connected health, Disposables, RCU, ATLASlite, HID, IoT, Medical, Proximity tags & trackers, Data pipes |
| Bluetooth® Mesh | Not Supported |
| CPU | M0+ |
| Clock Rate (MHz) | 16 |
| Execute from FLASH | No |
| Extended Advertising | Not Supported |
| External Rails and Load Capacity | None |
| Flash Memory (KB) | 0, 0 |
| Flexible System Clock | Yes |
| GATT Caching | Not Supported |
| GPIOs (#) | 9 |
| Hardware Crypto Engine | Yes |
| I2C (#) | 1 |
| Integrated Battery Charger | No |
| Integrated DCDC | Integrated Buck DC-DC converter |
| LE Coded PHY (Long Range) | Not Supported |
| LE Data Length Extensions | Supported |
| Longevity | 2400 Jul |
| MCU/MPU | M0 + |
| MOQ | 1000 |
| Memory Size (OTP) (KB) | 32 |
| Operating Freq (Max) (MHz) | 16 |
| Output Power Range (dBm) | -19.5 - 2.5 |
| Periodic Advertising | Not Supported |
| Pitch (mm) | 1.5 |
| Pkg. Dimensions (mm) | 12.5 x 14.5 x 2.8 |
| Pkg. Type | MODULE |
| Proprietary 2G4 protocol | No |
| QSPI Interface (#) | 0 |
| RAM (KB) | 48 |
| ROM (KB) | 144 |
| Recommended for new Designs | Yes |
| Rx current (mA) | 2.2 |
| SPI (#) | 1 |
| Sensitivity (dBm) (dBm) | -94 |
| Supply Voltage Vcc Range | 1.8-3.6 |
| Tx Current (mA) | 3.5 |
| UART (#) | 2 |
| USB Ports (#) | 0 |
| Wireless Standard | BLE 5.1 Core specification |
Description
The DA14531 SmartBond TINY™ Module is the Bluetooth® Low Energy (LE) solution that will power the next 1 billion IoT devices through ease of use.
The DA14531 SmartBond TINY™ Module, based on the world’s smallest and lowest power Bluetooth 5.1 system-on-chip (SoC), brings the DA14531 SoC advantages to an integrated module. It just requires a power supply and a printed circuit board to build a Bluetooth application. The module targets broad market use and is certified across regions providing significant savings in development cost and time-to-market. It comes with an integrated antenna and easy-to-use software making Bluetooth Low Energy development easier than ever before. This combination takes mobile connectivity to applications previously out of reach, enabling the next billion IoT devices, with SmartBond TINY™ at their core.
Need for a pre-programmed DA14531 TINY Module with your own code?
Digi-Key® and EPS Global are selected third parties who provide programming services of small sample to high volume batches.
Image
| Digi-Key is one of the fastest growing distributors of electronic components in the world. For more information on Digi-Key’s programming services contact [email protected]. |
Image
| EPS Global is one of the world's largest programming service providers. For more information on EPS Global’s programming services go to www.epsprogramming.com or contact Munteanu Florentin. |