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Package Information

Pkg. Type: WLCSP
Pkg. Code:
Lead Count (#): 17
Pkg. Dimensions (mm): 1.7 x 2 x 0.328
Pitch (mm): 0.4

Environmental & Export Classifications

Moisture Sensitivity Level (MSL) 1
Pb (Lead) Free Yes
ECCN (US)
HTS (US)

Product Attributes

Lead Count (#) 17
Carrier Type Tape & Reel
Moisture Sensitivity Level (MSL) 1
Pitch (mm) 0.4
Pkg. Dimensions (mm) 1.7 x 2 x 0.328
Pb (Lead) Free Yes
Temp. Range (°C) -40 to +85°C
Country of Assembly Singapore
Country of Wafer Fabrication Taiwan
Price (USD) 1.3334
2Mbps Not Supported
ADC 10-bit x 4-ch
AoA Not Supported
AoD Not Supported
Application Asset tracking, Beacons, Connected health, Disposables, RCU, ATLASlite, HID, IoT, Low cost BLE connectivity front-end, Medical, Proximity tags & trackers, Data pipes
Bluetooth® Mesh Not Supported
Budgetary Price (100u) (USD) 1.02
Budgetary Price (1ku) (USD) 0.805
Budgetary Price (1u) (USD) 1.534
CPU M0+
Clock Rate (MHz) 16
Execute from FLASH No
Extended Advertising Not Supported
External Rails and Load Capacity None
Flash Memory (KB) 0
Flexible System Clock Yes
GATT Caching Not Supported
GPIOs (#) 6
Hardware Crypto Engine Yes
I2C (#) 1
Integrated Battery Charger No
Integrated DCDC Integrated Buck/Boost DC-DC converter
LE Coded PHY (Long Range) Not Supported
LE Data Length Extensions Supported
Longevity 2034 Nov
MCU/MPU M0 +
MOQ 4000
Memory Size (OTP) (KB) 32
Operating Freq (Max) (MHz) 16
Output Power Range (dBm) -19.5 - 2.5
Periodic Advertising Not Supported
Pkg. Type WLCSP
Proprietary 2G4 protocol No
QSPI Interface (#) 0
Qty. per Reel (#) 4000
RAM (KB) 48
ROM (KB) 144
Recommended for new Designs Yes
Rx current (mA) 2.2
SPI (#) 1
Sensitivity (dBm) (dBm) -94
Supply Voltage Vcc Range 1.1-3.6
Tx Current (mA) 3.5
UART (#) 2
USB Ports (#) 0
Wireless Standard BLE 5.1 Core specification

Description

SmartBond TINY™, the world’s smallest and lowest power Bluetooth® 5.1 System-on-Chip (SoC), brings down the cost of adding Bluetooth Low Energy (LE) in any system and takes mobile connectivity to places previously out of reach, triggering a wave of a billion IoT devices, all with SmartBond TINY at the heart.

The low system cost is achieved through the high level of integration in SmartBond TINY: A complete Bluetooth Low Energy system can be achieved with the addition of six tiny external passives, a crystal, and a power source. To lower the barrier of entry, SmartBond TINY is also available in an easy-to-use tiny module incorporating all the needed components, making the addition of Bluetooth Low Energy to any application a simple drop-in.

Record low hibernation and active power consumption ensure long operating and shelf life with even the tiniest, disposable batteries. Based on a powerful 32-bit Arm® Cortex®-M0+ with integrated memories and a complete set of analog and digital peripherals, SmartBond TINY is extremely power efficient, delivering a record score of 18300 on the latest EEMBC benchmark for IoT connectivity, IoTMark™.

The DA14531-01 variant of the DA14531 is optimized for peripheral-only applications and provides around 25% additional user RAM memory for a typical Bluetooth LE application compared to the DA14531-00 and is pin-to-pin compatible.

The DA14530 is pin-to-pin compatible with the DA14531 in a 2.2mm x 3.0mm FCGQFN24 package and provides cost savings by operating from an internal LDO, eliminating the cost of a DC/DC inductor.

Available in a tiny 2.0mm x 1.7mm package, the DA14531 is half the size of its predecessor or any offering from other leading manufacturers. And, it is complemented by a flexible software development kit (SDK) supporting major compilers such as Keil and GCC out of the box.

Learn more about the DA14531MOD module.