Pkg. Type: | WLCSP |
Pkg. Code: | |
Lead Count (#): | 17 |
Pkg. Dimensions (mm): | 1.7 x 2 x 0.328 |
Pitch (mm): | 0.4 |
Moisture Sensitivity Level (MSL) | 1 |
Pb (Lead) Free | Yes |
ECCN (US) | |
HTS (US) |
Lead Count (#) | 17 |
Carrier Type | Tape & Reel |
Moisture Sensitivity Level (MSL) | 1 |
Pitch (mm) | 0.4 |
Pkg. Dimensions (mm) | 1.7 x 2 x 0.328 |
Pb (Lead) Free | Yes |
Temp. Range (°C) | -40 to +85°C |
Country of Assembly | Singapore |
Country of Wafer Fabrication | Taiwan |
Price (USD) | 1.3334 |
2Mbps | Not Supported |
ADC | 10-bit x 4-ch |
AoA | Not Supported |
AoD | Not Supported |
Application | Asset tracking, Beacons, Connected health, Disposables, RCU, ATLASlite, HID, IoT, Low cost BLE connectivity front-end, Medical, Proximity tags & trackers, Data pipes |
Bluetooth® Mesh | Not Supported |
Budgetary Price (100u) (USD) | 1.02 |
Budgetary Price (1ku) (USD) | 0.805 |
Budgetary Price (1u) (USD) | 1.534 |
CPU | M0+ |
Clock Rate (MHz) | 16 |
Execute from FLASH | No |
Extended Advertising | Not Supported |
External Rails and Load Capacity | None |
Flash Memory (KB) | 0 |
Flexible System Clock | Yes |
GATT Caching | Not Supported |
GPIOs (#) | 6 |
Hardware Crypto Engine | Yes |
I2C (#) | 1 |
Integrated Battery Charger | No |
Integrated DCDC | Integrated Buck/Boost DC-DC converter |
LE Coded PHY (Long Range) | Not Supported |
LE Data Length Extensions | Supported |
Longevity | 2034 Nov |
MCU/MPU | M0 + |
MOQ | 4000 |
Memory Size (OTP) (KB) | 32 |
Operating Freq (Max) (MHz) | 16 |
Output Power Range (dBm) | -19.5 - 2.5 |
Periodic Advertising | Not Supported |
Pkg. Type | WLCSP |
Proprietary 2G4 protocol | No |
QSPI Interface (#) | 0 |
Qty. per Reel (#) | 4000 |
RAM (KB) | 48 |
ROM (KB) | 144 |
Recommended for new Designs | Yes |
Rx current (mA) | 2.2 |
SPI (#) | 1 |
Sensitivity (dBm) (dBm) | -94 |
Supply Voltage Vcc Range | 1.1-3.6 |
Tx Current (mA) | 3.5 |
UART (#) | 2 |
USB Ports (#) | 0 |
Wireless Standard | BLE 5.1 Core specification |
SmartBond TINY™, the world’s smallest and lowest power Bluetooth® 5.1 System-on-Chip (SoC), brings down the cost of adding Bluetooth Low Energy (LE) in any system and takes mobile connectivity to places previously out of reach, triggering a wave of a billion IoT devices, all with SmartBond TINY at the heart.
The low system cost is achieved through the high level of integration in SmartBond TINY: A complete Bluetooth Low Energy system can be achieved with the addition of six tiny external passives, a crystal, and a power source. To lower the barrier of entry, SmartBond TINY is also available in an easy-to-use tiny module incorporating all the needed components, making the addition of Bluetooth Low Energy to any application a simple drop-in.
Record low hibernation and active power consumption ensure long operating and shelf life with even the tiniest, disposable batteries. Based on a powerful 32-bit Arm® Cortex®-M0+ with integrated memories and a complete set of analog and digital peripherals, SmartBond TINY is extremely power efficient, delivering a record score of 18300 on the latest EEMBC benchmark for IoT connectivity, IoTMark™.
The DA14531-01 variant of the DA14531 is optimized for peripheral-only applications and provides around 25% additional user RAM memory for a typical Bluetooth LE application compared to the DA14531-00 and is pin-to-pin compatible.
The DA14530 is pin-to-pin compatible with the DA14531 in a 2.2mm x 3.0mm FCGQFN24 package and provides cost savings by operating from an internal LDO, eliminating the cost of a DC/DC inductor.
Available in a tiny 2.0mm x 1.7mm package, the DA14531 is half the size of its predecessor or any offering from other leading manufacturers. And, it is complemented by a flexible software development kit (SDK) supporting major compilers such as Keil and GCC out of the box.
Learn more about the DA14531MOD module.