Features
- All digital Class-D amplifier and controller with integrated Digital Signal Processing (DSP)
- Four integrated Power Stages supporting: 2 Channels, Bridged, 4 Channels, Half-Bridge, 2 Channels, Half-Bridge, plus 1 Channel, Bridged
- Output power (bridged): 25W (8Ω, <1% THD); 30W (8Ω, <10% THD)
- Fully programmable Digital Signal Processing (DSP)
- Includes D2 Audio DSP Sound Enhancement Algorithm and DTS®(SRS) WOW/HD™ Audio Enhancement Algorithms
- I2S and S/PDIF™ digital audio inputs
- Asynchronous sample rate converters; sample rates from 32kHz up to 192kHz
- Wide 9V to 26V Power Stage HV supply range, plus internally-generated gate drive supply
- Temperature and undervoltage monitoring and individual channel protection
D2-45057_D2-45157 Functional Diagram
Description
The D2-4P (D2-45057 and D2-45157) devices are complete System-on-Chip (SoC) Class-D digital audio amplifiers. These devices combine high performance integrated Power Stages, an optimized Audio Processor feature set, and a PWM controller to offer a complete, powerful, and very cost effective audio solution for high volume and cost-critical products. This 4th generation Digital Audio Processor (D2-4P) device combines extensive integrated Digital Signal Processor (DSP) audio processing with amplifier control for a complete audio solution. Its ease of integration into the existing system processor provides complete support for all system product and amplifier functions. The four configurable Power Stages operate as four separate Half-Bridge outputs, as two Full-Bridge outputs, or in combinations of Half-Bridge plus Full-Bridge, which provides flexible loudspeaker drive solutions. Separate PWM outputs provide additional combinations to drive headphone outputs or line level stereo and subwoofer outputs.
Applications
- PC/Multimedia Speakers
- Digital TV Audio Systems
- Portable Device Docking Stations
- Powered Speaker Systems
| Part Number | Status | Samples | Stock | Package | Carrier Type | MOQ | Moisture Sensitivity Level (MSL) |
|---|---|---|---|---|---|---|---|
| D2-45057-QR | Obsolete | N/A | In Stock | QFN | Tube | 600 | 3 |
| D2-45057-QR-T | Obsolete | N/A | Out of Stock | QFN | Reel | 3000 | 3 |
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- Application NotePDF 184 KB r32an0007eu0100-d2-audio-dsp-output-filter-design May 20, 2019AI-generated Summary: The document explains the design and selection of output filters for D2 Audio DSP half-bridge and full-bridge configurations. It details the half-bridge output stage, filter network, and bias network that provides a DC offset and AC ground reference. It covers filter operation principles, emphasizing the second-order LC low-pass filter to attenuate high-frequency PWM signals. Loudspeaker impedance impacts filter damping and response. Recommended component values for inductors, capacitors, and bias networks are provided for various load impedances and power ratings.
- Application NotePDF 147 KB r32an0006eu-d2-audio-eeprom-spi May 15, 2019AI-generated Summary: The document explains procedures for writing firmware and parameter data to EEPROM or SPI Flash memories in D2 Audio DSP systems using an external microcontroller. It details booting methods, control pin configurations, and communication protocols for different D2 Audio device families (D2-1, D2-3, D2-4, D2-6). The process involves loading bootloader or boot code hex files, writing settings to memory, and rebooting to run from the updated non-volatile memory. Specific I2C addresses and pin states are critical for successful operations.
- Application NotePDF 506 KB r32an0004eu-d2-4-d2-4p May 15, 2019AI-generated Summary: The document details the D2-4/D2-4P API register specifications for audio DSP sound enhancement. Registers are accessed via an I2C interface with 24-bit hexadecimal addresses and data. It explains register read/write sequences, default parameter settings, and EEPROM storage for parameter retention. The register address map defines specific functions like volume control, mixers, equalizers, filters, and compressors. Audio processing is managed by internal firmware and DSP, with programmable parameters controlling signal flow and processing blocks.
- Application NotePDF 445 KB r32an0003eu-d2-4p May 14, 2019AI-generated Summary: The document provides detailed layout guidelines for the D2-4P device, emphasizing proper grounding, noise reduction, and heat dissipation techniques. It recommends connecting the IREF resistor directly to the thermal pad ground, minimizing noise by routing signals carefully, and maximizing copper area for thermal performance. Component placement prioritizes decoupling capacitors near the device, followed by bootstrap and filter capacitors. The thermal pad on the PCB serves as both a heat dissipation path and a ground connection, with multiple ground pins tied directly to it. Use of stitching vias and careful via placement enhances thermal and electrical performance.
- Application NotePDF 297 KB r32an0002eu-d2-audio-dsp May 13, 2019AI-generated Summary: The D2 Audio Customization GUI v3 offers a comprehensive set of audio processing blocks including Excursion Control, Delay, Compressor, Expander, Envelope VCA, Reverb, Chime Generator, RMS Level Meter, Fade-Pan, Mono Mixer, Dither Generator, Harmonics Generator, and Compound Blocks. It supports real-time interactive control with graphical displays for magnitude and phase, enabling precise parameter adjustments. The software allows flexible signal flow editing with dynamic register addressing and integration of third-party virtualization algorithms. Each audio block has dedicated registers, and the system generates updated header files for seamless controller integration.
Recommended Documents (1)
Datasheets (1)
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- Application NotePDF 184 KB r32an0007eu0100-d2-audio-dsp-output-filter-design May 20, 2019AI-generated Summary: The document explains the design and selection of output filters for D2 Audio DSP half-bridge and full-bridge configurations. It details the half-bridge output stage, filter network, and bias network that provides a DC offset and AC ground reference. It covers filter operation principles, emphasizing the second-order LC low-pass filter to attenuate high-frequency PWM signals. Loudspeaker impedance impacts filter damping and response. Recommended component values for inductors, capacitors, and bias networks are provided for various load impedances and power ratings.
- Application NotePDF 147 KB r32an0006eu-d2-audio-eeprom-spi May 15, 2019AI-generated Summary: The document explains procedures for writing firmware and parameter data to EEPROM or SPI Flash memories in D2 Audio DSP systems using an external microcontroller. It details booting methods, control pin configurations, and communication protocols for different D2 Audio device families (D2-1, D2-3, D2-4, D2-6). The process involves loading bootloader or boot code hex files, writing settings to memory, and rebooting to run from the updated non-volatile memory. Specific I2C addresses and pin states are critical for successful operations.
- Application NotePDF 506 KB r32an0004eu-d2-4-d2-4p May 15, 2019AI-generated Summary: The document details the D2-4/D2-4P API register specifications for audio DSP sound enhancement. Registers are accessed via an I2C interface with 24-bit hexadecimal addresses and data. It explains register read/write sequences, default parameter settings, and EEPROM storage for parameter retention. The register address map defines specific functions like volume control, mixers, equalizers, filters, and compressors. Audio processing is managed by internal firmware and DSP, with programmable parameters controlling signal flow and processing blocks.
- Application NotePDF 445 KB r32an0003eu-d2-4p May 14, 2019AI-generated Summary: The document provides detailed layout guidelines for the D2-4P device, emphasizing proper grounding, noise reduction, and heat dissipation techniques. It recommends connecting the IREF resistor directly to the thermal pad ground, minimizing noise by routing signals carefully, and maximizing copper area for thermal performance. Component placement prioritizes decoupling capacitors near the device, followed by bootstrap and filter capacitors. The thermal pad on the PCB serves as both a heat dissipation path and a ground connection, with multiple ground pins tied directly to it. Use of stitching vias and careful via placement enhances thermal and electrical performance.
- Application NotePDF 297 KB r32an0002eu-d2-audio-dsp May 13, 2019AI-generated Summary: The D2 Audio Customization GUI v3 offers a comprehensive set of audio processing blocks including Excursion Control, Delay, Compressor, Expander, Envelope VCA, Reverb, Chime Generator, RMS Level Meter, Fade-Pan, Mono Mixer, Dither Generator, Harmonics Generator, and Compound Blocks. It supports real-time interactive control with graphical displays for magnitude and phase, enabling precise parameter adjustments. The software allows flexible signal flow editing with dynamic register addressing and integration of third-party virtualization algorithms. Each audio block has dedicated registers, and the system generates updated header files for seamless controller integration.
Application Notes & White Papers (5)
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