Features
- High-voltage type (20V Rating)
- Inverting type
- High sink current for driving 2 TTL loads
- High-to-low level logic conversion
- 100% tested for quiescent current at 20V
- Maximum input current of 1µA at 18V over full package temperature range; 100nA at 18V and +25 °C
- 5V, 10V and 15V parametric ratings
Description
The CD4049UBMS is an inverting hex buffer and features logic level conversion using only one supply voltage (VCC). The input signal high level (VIH) can exceed the VCC supply voltage when this device is used for logic-level conversions. This device is intended for use as CMOS to DTL/TTL converters and can drive directly two DTL/TTL loads. (VCC = 5V, VOL ≤ 0. 4V, and IOL ≥ 3. 3mA). The CD4049UBMS is designated as a replacement for the CD4009UB. Because the CD4049UBMS requires only one power supply, it is preferred over the CD4009UB and CD4010B and should be used in place of the CD4009UB in all inverter, current driver, or logic level conversion applications. In these applications, the CD4049UBMS is pin-compatible with the CD4009UB and can be substituted for this device in existing as well as in new designs. Terminal No. 16 is not connected internally on the CD4049UBMS; therefore, connection to this terminal is of no consequence to circuit operation. For applications not requiring high sink current or voltage conversion, the CD4069UB hex inverter is recommended. The CD4049UBMS is supplied in these 16-lead outline packages: Braze Seal DIP H4S, Frit Seal DIP H1E, Ceramic Flatpack H3X.
Applications
- CMOS to DTL/TTL hex converter
- CMOS current "Sink" or "Source" driver
- CMOS high-to-low logic level converter
| Part Number | Status | Samples | Stock | RoHS | Package | Lead Count (#) | Carrier Type | Moisture Sensitivity Level (MSL) | Pitch (mm) | Pkg. Dimensions (mm) | DLA SMD | Pb (Lead) Free | Pb Free Category | MOQ | Temp. Range (°C) | CAGE code |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| CD4049UBDMSR | Obsolete | N/A | Out of Stock | Contact | SBDIP | 16# | Tube | Not Applicable | 2.5mm | 20.3 x 7.5 x 2.41 | 5962R9663601VEC | Exempt | Gold Plate over compliant Undercoat-e4 | 25 | -55 to +125°C | 34371 |
| CD4049UBHSR | Last Time Buy | Available | Out of Stock | RoHS:EN RoHS:JA | DIE | Die Waffle Pack | Not Applicable | 0.0 x 0.0 x 0.00 | 5962R9663601V9A | Yes | None | 100 | -55 to +125°C | 34371 | ||
| CD4049UBKMSR | Obsolete | N/A | Out of Stock | Contact | CFP | 16# | Tray | Not Applicable | 1.3mm | 10.4 x 6.9 x 0.00 | 5962R9663601VXC | Exempt | Gold Plate over compliant Undercoat-e4 | 25 | -55 to +125°C | 34371 |
| CD4049UBKNSR | Obsolete | N/A | Out of Stock | Contact | CFP | 16# | Tray | Not Applicable | 1.3mm | 10.4 x 6.9 x 0.00 | 5962R9663602VXC | Exempt | Gold Plate over compliant Undercoat-e4 | 25 | -55 to +125°C | 34371 |
Filters
Applied Filters
- Price Increase NoticePDF 360 KB PIN19011 Apr 10, 2019
- Product AdvisoryPDF 499 KB PA11003 Jan 05, 2011
- Product Change NoticePDF 230 KB PCN10123 Dec 06, 2010
- Application NotePDF 224 KB an9654 May 05, 1999AI-generated Summary: The document explains the reliability and failure mechanisms of semiconductor parts, focusing on life testing and wearout. It discusses how switching states cause transient current pulses and hot carrier injection, which only occur briefly during switching. Life testing at elevated temperatures accelerates aging to remove infant mortality failures, improving reliability. The failure rate follows a bathtub curve with infant mortality, useful life, and wearout phases, modeled by lognormal and exponential distributions. The Arrhenius equation relates failure rates at different temperatures. Burn-in and life tests reduce early failures without harming intrinsic reliability.
Recommended Documents (1)
Datasheets (1)
No Results Found.
Make sure all keywords are spelled correctly.
Try fewer, different, or more general terms to vary your search.
If you have filters applied, consider deselecting some to broaden your results.
- Search our extensive knowledgebase, designed to help customers with their FAQs.
- Get help from our expert Renesas technical staff and community on our support forums.
- Application NotePDF 224 KB an9654 May 05, 1999AI-generated Summary: The document explains the reliability and failure mechanisms of semiconductor parts, focusing on life testing and wearout. It discusses how switching states cause transient current pulses and hot carrier injection, which only occur briefly during switching. Life testing at elevated temperatures accelerates aging to remove infant mortality failures, improving reliability. The failure rate follows a bathtub curve with infant mortality, useful life, and wearout phases, modeled by lognormal and exponential distributions. The Arrhenius equation relates failure rates at different temperatures. Burn-in and life tests reduce early failures without harming intrinsic reliability.
Application Notes & White Papers (1)
- Price Increase NoticePDF 360 KB PIN19011 Apr 10, 2019
- Product AdvisoryPDF 499 KB PA11003 Jan 05, 2011
- Product Change NoticePDF 230 KB PCN10123 Dec 06, 2010
Product Notices (PCN, EOL, etc) (3)
No Results Found.
Make sure all keywords are spelled correctly.
Try fewer, different, or more general terms to vary your search.
If you have filters applied, consider deselecting some to broaden your results.
- Search our extensive knowledgebase, designed to help customers with their FAQs.
- Get help from our expert Renesas technical staff and community on our support forums.
No Results Found.
Make sure all keywords are spelled correctly.
Try fewer, different, or more general terms to vary your search.
If you have filters applied, consider deselecting some to broaden your results.
- Search our extensive knowledgebase, designed to help customers with their FAQs.
- Get help from our expert Renesas technical staff and community on our support forums.
No Results Found.
Make sure all keywords are spelled correctly.
Try fewer, different, or more general terms to vary your search.
If you have filters applied, consider deselecting some to broaden your results.
- Search our extensive knowledgebase, designed to help customers with their FAQs.
- Get help from our expert Renesas technical staff and community on our support forums.
No Results Found.
Make sure all keywords are spelled correctly.
Try fewer, different, or more general terms to vary your search.
If you have filters applied, consider deselecting some to broaden your results.
- Search our extensive knowledgebase, designed to help customers with their FAQs.
- Get help from our expert Renesas technical staff and community on our support forums.
No Results Found.
Make sure all keywords are spelled correctly.
Try fewer, different, or more general terms to vary your search.
If you have filters applied, consider deselecting some to broaden your results.
- Search our extensive knowledgebase, designed to help customers with their FAQs.
- Get help from our expert Renesas technical staff and community on our support forums.
No Results Found.
Make sure all keywords are spelled correctly.
Try fewer, different, or more general terms to vary your search.
If you have filters applied, consider deselecting some to broaden your results.
- Search our extensive knowledgebase, designed to help customers with their FAQs.
- Get help from our expert Renesas technical staff and community on our support forums.
Marketing Collateral (1)
Other (1)
No Results Found.
Make sure all keywords are spelled correctly.
Try fewer, different, or more general terms to vary your search.
If you have filters applied, consider deselecting some to broaden your results.
- Search our extensive knowledgebase, designed to help customers with their FAQs.
- Get help from our expert Renesas technical staff and community on our support forums.
No Results Found.
Make sure all keywords are spelled correctly.
Try fewer, different, or more general terms to vary your search.
If you have filters applied, consider deselecting some to broaden your results.
- Search our extensive knowledgebase, designed to help customers with their FAQs.
- Get help from our expert Renesas technical staff and community on our support forums.