Features
- LP-HCSL outputs; save 10 resistors and 17mm² compared to standard HCSL
- PCIe Gen 1–5 compliance
- 50mW typical power consumption; eliminates thermal concerns
- OE# pin for each output; support DIF power management
- HCSL differential input; can be driven by common clock sources
- Spread spectrum tolerant; allows reduction of EMI
- SMBus-selectable features allow optimization to customer requirements
- Slew rate for each output; allows tuning for various line lengths
- Differential output amplitude; allows tuning for various application environments
- 1MHz to 200MHz operating frequency
- 3.3V tolerant SMBus interface works with legacy controllers
- Selectable SMBus addresses; multiple devices can easily share an SMBus segment
- Device contains default configuration; SMBus interface is not required for device operation
- Space saving 32-pin 5mm x 5mm VFQFPN; minimal board space
Description
The 9DBV0531 5-output 1.8V PCIe fanout clock buffer has five output enables for clock management and three selectable SMBus addresses.
Parameters
| Attributes | Value |
|---|---|
| Diff. Outputs | 5 |
| Diff. Output Signaling | LP-HCSL |
| Output Freq Range (MHz) | 1 - 200 |
| Diff. Inputs | 1 |
| Diff. Input Signaling | HCSL |
| Accepts Spread Spec Input | Yes |
| Power Consumption Typ (mW) | 45 |
| Supply Voltage (V) | 1.8 - 1.8 |
| Output Type | LP-HCSL |
| Diff. Termination Resistors | 16 |
| Package Area (mm²) | 25 |
| Battery Backup | No |
| Battery Seal | No |
| CPU Supervisory Function POR | No |
| Crystal Frequency Trimming | No |
| Frequency Out Pin | No |
| Inputs (#) | 1 |
| Input Freq (MHz) | 1 - 200 |
| Divider Value | 1 |
| Additive Phase Jitter Typ RMS (fs) | 250 |
| Function | Fanout Buffer |
| Input Type | HCSL |
| Output Banks (#) | 1 |
| Core Voltage (V) | 1.8 |
| Output Voltage (V) | 0.8 |
| Product Category | PCI Express Clocks |
Package Options
| Pkg. Type | Pkg. Dimensions (mm) | Lead Count (#) | Pitch (mm) |
|---|---|---|---|
| VFQFPN | 5.0 x 5.0 x 0.9 | 32 | 0.5 |
Applications
- Servers/High-performance computing
- nVME storage
- Networking
- Accelerators
- Industrial control
| Part Number | Status | Samples | Longevity | Stock | Package | Budgetary Price (USD) | Lead Count (#) | Carrier Type | Moisture Sensitivity Level (MSL) | Qty. per Reel (#) | Qty. per Carrier (#) | Pb (Lead) Free | Pb Free Category | Temp. Range (°C) | Country of Assembly | Country of Wafer Fabrication |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 9DBV0531AKILF | Active | Available | 2040 Apr | In Stock | VFQFPN | 1ku | $1.33 | 32# | Tray | 3 | 0 | 490# | Yes | e3 Sn | -40 to 85°C | MALAYSIA | TAIWAN |
| 9DBV0531AKILFT | Active | N/A | 2040 Apr | In Stock | VFQFPN | 1ku | $1.33 | 32# | Reel | 3 | 2500# | 0 | Yes | e3 Sn | -40 to 85°C | MALAYSIA | TAIWAN |
| 9DBV0531AKLF | Active | Available | 2040 Apr | Out of Stock | VFQFPN | 1ku | $1.21 | 32# | Tray | 3 | 0 | 490# | Yes | e3 Sn | 0 to 70°C | MALAYSIA | TAIWAN |
| 9DBV0531AKLFT | Active | N/A | 2040 Apr | Out of Stock | VFQFPN | 1ku | $1.21 | 32# | Reel | 3 | 2500# | 0 | Yes | e3 Sn | 0 to 70°C | MALAYSIA | TAIWAN |
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- Application NotePDF 431 KB 7WDXRDKU4E7E-5-59216 Dec 06, 2023
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- Application NotePDF 170 KB 7WDXRDKU4E7E-5-57318 May 13, 2014
- Application NotePDF 1.9 MB 7WDXRDKU4E7E-5-57315 May 13, 2014
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- Application NotePDF 442 KB 7WDXRDKU4E7E-5-57298 May 08, 2014
- Product Change NoticePDF 983 KB Jun 25, 2019
- Product BriefPDF 378 KB 7WDXRDKU4E7E-6-1169 Aug 14, 2012
Recommended Documents (1)
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- Application NotePDF 431 KB 7WDXRDKU4E7E-5-59216 Dec 06, 2023
- Application NotePDF 1.99 MB 7WDXRDKU4E7E-5-57242 Mar 01, 2022
- Application NotePDF 235 KB 7WDXRDKU4E7E-5-58851 Apr 08, 2015
- Application NotePDF 170 KB 7WDXRDKU4E7E-5-57318 May 13, 2014View More (9)
Application Notes & White Papers (9)
- Product Change NoticePDF 734 KB Nov 16, 2022
- Product Change NoticePDF 728 KB May 13, 2022
- Product Change NoticePDF 983 KB Jun 25, 2019
- Product Change NoticePDF 583 KB 7WDXRDKU4E7E-5-61343 Dec 20, 2016
- Product Change NoticePDF 596 KB 7WDXRDKU4E7E-5-59884 Jan 28, 2016View More (7)
Product Notices (PCN, EOL, etc) (7)
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- Product BriefPDF 378 KB 7WDXRDKU4E7E-6-1169 Aug 14, 2012
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A detailed overview of IDT's full-featured PCI Express (PCIe) clock and timing solutions. The presentation addresses PCIe Gen 1, Gen 2, Gen 3, and Gen 4 architectures and how IDT's industry-leading solutions provide all the functions, features, and performance required by the application.
Presented by Ron Wade, System Architect at IDT. For more information visit the PCIe clocks page.
This is the first video in our PCIe series. In this video, we define PCIe architectures, focusing on common and separate clock architectures. Watch the rest of the video series below where Ron will cover the impact of different timing architectures.
In this episode, Ron Wade from IDT (acquired by Renesas) explains PCIe common clocking and its impact on timing solutions. Learn about using a single clock source, fan-out buffers, and the considerations for spread spectrum and non-spread spectrum clocking in PCIe systems.
In this video, we explore PCIe with separate reference clocks and the effects of clock selection. Learn how separate reference clocks work and their impact on system performance and stability.
This video provides a high-level overview of Separate Reference Clock with Independent Spread (SRIS) architectures for PCI Express systems, additional performance requirements that this clocking architecture imposes on the reference clocks, and some system implications encountered trying to implement the architecture.
IDT (acquired by Renesas) engineer provides a brief tutorial describing the main differences between standard HCSL and low-power HCSL (LP-HCSL).
Presented by Ron Wade, PCI Express timing expert.
An overview of IDT's full-featured PCI Express (PCIe) clock zero-delay buffers and fanout buffers addressing PCIe Gen 1, Gen 2, Gen 3, and Gen 4.
Presented by Ron Wade, System Architect at IDT.
An overview of PCI Express applications and how IDT's industry-leading portfolio of PCIe clock products addresses the requirements. The video briefly discusses PCIe riser cards, embedded SOC, and PCIe storage (NVME) examples.
Presented by Ron Wade, System Architect at IDT.
A brief overview of how data rates have changed from PCI Express (PCIe) Generation 1, Gen 2, Gen 3, Gen 4 and Gen 5.
Presented by Ron Wade, system architect at IDT.
A brief overview of how clock and timing specifications have changed from PCI Express (PCIe) Generation 1, Gen 2, Gen 3, Gen 4 and Gen 5.
Presented by Ron Wade, system architect at IDT (acquired by Renesas).
A brief overview of the PCI Express common clock (CC) jitter model, and the transfer functions as they relate to the timing PLLs. This model applies to PCI Express (PCIe) Gen 2, Gen 3, Gen 4 and Gen 5. The equations would be slightly different for other PCIe architectures, such as SRIS, SRnS, or data clocked.
Presented by Ron Wade, system architect at IDT (acquired by Renesas). For more information about Renesas's PCIe timing solutions, visit the PCI Express (PCIe) Clocks page.
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