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3.3V 128K x 8 Asynchronous Static RAM Center Power & Ground Pinout

Package Information

Lead Count (#) 32
Pkg. Code PHG32
Pitch (mm) 1.27
Pkg. Type TSOP
Pkg. Dimensions (mm) 20.95 x 10.16 x 1.0

Environmental & Export Classifications

Pb (Lead) Free Yes
Moisture Sensitivity Level (MSL) 3
ECCN (US) NLR
HTS (US) 8542320041

Product Attributes

Lead Count (#) 32
Pb (Lead) Free Yes
Carrier Type Reel
Moisture Sensitivity Level (MSL) 3
Access Time (ns) 12
Architecture Asynchronous
Bus Width (bits) 8
Core Voltage (V) 3.3
Density (Kb) 1024
I/O Voltage (V) 3.3 - 3.3
Length (mm) 20.95
MOQ 1500
Organization 128K x 8
Package Area (mm²) 212.9
Pb Free Category e3 Sn
Pitch (mm) 1.27
Pkg. Dimensions (mm) 20.95 x 10.16 x 1.0
Pkg. Type TSOP
Qty. per Carrier (#) 0
Qty. per Reel (#) 1500
Reel Size (in) 13
Requires Terms and Conditions Does not require acceptance of Terms and Conditions
Tape & Reel Yes
Temp. Range 0 to 70°C
Thickness (mm) 1.0
Width (mm) 10.16

Description

The 71V124 3.3V CMOS SRAM is organized as 128K x 8. The JEDEC center power/GND pinout reduces noise generation and improves system performance. All bidirectional inputs and outputs of the 71V124 are LVTTL-compatible and operation is from a single 3.3V supply. Fully static asynchronous circuitry is used; no clocks or refreshes are required for operation.