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DICE (WAFER 0)

Title Information
Package Description
Descriptive text for this package.
DIE SALE (PRICE IN GOOD DIE), DIE SALE (PRICE IN GOOD DIE)-UNSAWN
Package Status
Active
Package Type
WAFER
Class
WAFER
Package Code
The unique identifier of this package.
DICE
Category
G
Lead Count
0
Pb (Lead) Free
Yes
Length
0mm
Pb Free Category
e3 Sn
Width
0mm
Thickness
Seated height or Package height
(Please check the outline drawing)
0mm
Pitch
0mm
Package Carrier
Wafer
Pkg. Dimensions (mm)
Package Dimensions. Example: 5 x 7 x 0.5
0.0 x 0.0 x 0.0

Documentation

Type Title Date
Package Outline Drawing PDF 696 KB
Package Outline Drawing PDF 716 KB
End Of Life Notice PDF 45 KB
3 items

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